R&D SERVICES BEYOND WAFER PROBE CARDS

Product catalog summary

Performance Study
This section focuses on CRes measurements during probing on customer or blank wafers using FM-technologies. It involves probing with varying parameters such as temperature, overtravel, and multiple TDs on the same pad/bump. The study includes analysis of lateral scrub dimensions using a wafer microscope and scrub mark-depth and pile-up analysis with an atomic force microscope. An optional pad crack analysis is also available.

Pad Crack Analysis
This involves probing with different parameters and analyzing lateral scrub dimensions with a wafer microscope. The process includes etching off pad material and conducting pad crack analysis with a wafer microscope. Optional scrub mark-depth and pile-up analysis with an atomic force microscope before etching is also offered.

Round Tip Shape AFM-Analysis
This section examines scrub marks after probing and pad cracks after etching.

Lifetime Study
Similar to the performance study, this involves CRes measurements and probing with different parameters. It includes analysis of lateral scrub marks dimensions and offers an optional customized cleaning recipe design.

RF Analysis
This service provides encrypted CAD data for high-frequency simulation. RF-Simulation data and information on lumped devices, power, and signal integrity can be created upon request. It includes a comparison of measurement results and simulation results for different options.

Customer Oriented Probe Card Service
FEINMETALL offers various levels of service agreements, ensuring on-the-spot support, guaranteed turnaround times, and custom-tailored solutions ranging from small repairs to complete repair shop management.

FM Services at a Glance
FEINMETALL GmbH provides years of experience and expertise in the wafer probing business, offering specific feasibility studies to find optimal probing solutions for different applications.

Catalog excerpts

R&D SERVICES BEYOND WAFER PROBE CARDS

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Performance Study • CRes measurements when probing on customer or blank wafer with FM-technologies Probing with different parameters such as temperature, overtravel, multi TDs on same pad/bump Analysis on lateral scrub dimensions with wafer microscope Scrub mark-depth and pile-up analysis with atomic force microscope Optional: Pad crack analysis Scrub Mark after Probing Pad Crack after Etching Probing with different parameters such as temperature, overtravel, multi TDs on same pad/bump Analysis on lateral scrub dimensions with wafer microscope Pad crack analysis with wafer microscope Optional:...

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Lifetime Study • CRes measurements when probing on customer or blank wafer with FM-technologies Probing with different parameters such as temperature, overtravel, multi TDs on same pad/bump Analysis on lateral scrub marks dimensions with wafer microscope Optional: Customized cleaning recipe design (with preferred cleaning material) Offering encrypted CAD (Protected project) data for the purpose of high-frequency simulation RF-Simulation data and information on lumped devices as well as information on power and signal integrity can be created on request Comparison of measurement results and simulation...

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FM Services at a Glance Encrypted CAD (Protected project) data Data packages Lumped devices Optional Performance Study CRes measurements Probing with different parameters Analysis on lateral scrub dimensions Scrub-depth and pile-up analysis Pad Crack analysis Customized cleaning recipe Power integrity Signal integrity Optional Pad Crack Analysis Optional Lifetime Study Years of experience and expertise in the wafer probing business enable us to find the right contact solution for every application and to guarantee a fail-safe worldwide test operation. FEINMETALL GmbH Zeppelinstrasse 8 71083 Herrenberg...

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R&D SERVICES BEYOND WAFER PROBE CARDS

R&D SERVICES BEYOND WAFER PROBE CARDS

Catalog excerpts

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