R&D SERVICES BEYOND WAFER PROBE CARDS

Performance Study • CRes measurements when probing on customer or blank wafer with FM-technologies Probing with different parameters such as temperature, overtravel, multi TDs on same pad/bump Analysis on lateral scrub dimensions with wafer microscope Scrub mark-depth and pile-up analysis with atomic force microscope Optional: Pad crack analysis Scrub Mark after Probing Pad Crack after Etching Probing with different parameters such as temperature, overtravel, multi TDs on same pad/bump Analysis on lateral scrub dimensions with wafer microscope Pad crack analysis with wafer microscope Optional:...

Lifetime Study • CRes measurements when probing on customer or blank wafer with FM-technologies Probing with different parameters such as temperature, overtravel, multi TDs on same pad/bump Analysis on lateral scrub marks dimensions with wafer microscope Optional: Customized cleaning recipe design (with preferred cleaning material) Offering encrypted CAD (Protected project) data for the purpose of high-frequency simulation RF-Simulation data and information on lumped devices as well as information on power and signal integrity can be created on request Comparison of measurement results and simulation...

FM Services at a Glance Encrypted CAD (Protected project) data Data packages Lumped devices Optional Performance Study CRes measurements Probing with different parameters Analysis on lateral scrub dimensions Scrub-depth and pile-up analysis Pad Crack analysis Customized cleaning recipe Power integrity Signal integrity Optional Pad Crack Analysis Optional Lifetime Study Years of experience and expertise in the wafer probing business enable us to find the right contact solution for every application and to guarantee a fail-safe worldwide test operation. FEINMETALL GmbH Zeppelinstrasse 8 71083 Herrenberg...