NP-535B  FEATURES  Super low dissipation factor at high frequency range  Rheology of resin controlled to benefit the lamination of the boards.  Flammability meets UL 94 V-0  PERFORMANCE LIST Characteristics Unit Process Test Method Differential phase length Surface resistivity Volume resistivity Loss tangent Moisture absorption Heat resistance Glass transition temp Glass transition temp Coefficient of thermal expansion Standard Thickness After Pressed Thickness (per ply) mm Mil 0.050±0.004 2.0±0.15 0.070±0.005 3.0±0.2 0.102±0.008 4.0±0.3 0.180±0.010 7.0±0.4 Requirement for not listed glass fabrics types, please contact our technical customer service team for discussion in advance. Storage Condit

Recommended press cycles: 1. Heating rate (110℃~150℃) 4.0℃/min is acceptable. 4.5℃/min is preferred. 2. Product temperature should be kept at higher 190℃ for more than 90 min to fully cure resin. 3. Pressure should be up to 450psi, high pressure is better for resin flowing and filling in the gaps. 4. Pressure should be kept below 200psi during cooling period. 5. Vacuum should be kept for at least 30 min from start. 6. Cushion for pressure evenness is n