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Bluetooth® low energy module Datasheet HY0021
1 /17Pages

Bluetooth® low energy module Datasheet HY0021

Bluetooth® low energy module Datasheet HY0021
1 /17Pages

Catalog excerpts

Bluetooth® low energy module Datasheet HY0021-1

■ The Bluetooth® word mark and logos are registered trademarks owned by Bluetooth SIG, Inc. and any use of such marks by FDK CORPORATION is under license. Other trademarks and trade names are those of their respective owners. ■ Arm and Cortex are registered trademarks of Arm Limited (or its subsidiaries) in the US and/or elsewhere. ■ FDK Corporation is granted a license to use Slot Antenna on Shielded Package Technology patented by Toshiba Corporation.

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Bluetooth® low energy module Datasheet HY0021-3

1 Product Overview and Features Bluetooth low energy module with "Slot Antenna on Shielded Package Technology” is a 2.4GHz wireless communication (Bluetooth) blank radio module with Nordic Semiconductor nRF52805. A basic protocol stack can be installed via Flash mounted on the IC, and various applications can be developed with this module alone. In addition, the module has acquired various radio and SIG certifications on its own, which simplifies various certifications for customers. • Slot Antenna on Shielded Package > Ultra-compact module with antenna pattern designed on the shield. Size: 3.5...

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Bluetooth® low energy module Datasheet HY0021-4

2. Brand name 3. Product number 4. Lot number

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Bluetooth® low energy module Datasheet HY0021-5

Figure 4-1 Pinout Diagram (Bottom View)

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Bluetooth® low energy module Datasheet HY0021-7

Reference Circuits Connect the RFIO and ANT terminals with the shortest possible length of 50Ω transmission line. Connect the DCC and DEC4 pins as shown in Figure 5-1 when using the built-in LDO and Figure 5-2 when using the built-in DC/DC converter. Regardless of the circuit connection status, a register setting by software is required. HY0021 B3 Figure 5-1 Built-in LDO regulator circuit example HY0021 B3 Figure 5-2 Built-in DC/DC converter circuit example

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Bluetooth® low energy module Datasheet HY0021-8

Absolute maximum ratings are standards that must not be exceeded even momentarily. Exceeding the absolute maximum ratings may cause deterioration or damage to internal components and may also destroy, damage, or degrade external circuits other than the module. The application equipment should be designed to ensure that the absolute maximum ratings are not exceeded under any operating conditions. Table 6-1 Absolute maximum ratings *2. Be sure to connect a bypass capacitor near the module for use. *3. The on-chip power-on reset circuitry may not function properly for rise times longer than the...

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Bluetooth® low energy module Datasheet HY0021-10

Table 7-1 Packaging materials 2. Aluminum moisture barrier bag Packing quantity: 10,000pcs max. _(5 inner cartons max.) Figure 7-1 Packaging style

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Bluetooth® low energy module Datasheet HY0021-11

FDK CORPORATION eiajc-3 made in japan -*v (2) Packing date (yyyy/mm/dd) Figure 7-2 Label 1 Caution 1. Calculated shelf life in sealed bag: 12 months at <40 "C and <90% relative humidity (RH) 2. Peak package body temperature: 70 *C IF blank, see adjacent bar code label 3. After bag is opend, devices that will be subjected to reflow solder of other high temperature process must be a) Mounted within: 168 hours of factory conditions if blank, see adjacenl bar code label 4. Devices require bake, before mounting, if: a) Humidity Indicator Card reads > 10% for level 2a - 5a devices of >60% for level...

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Bluetooth® low energy module Datasheet HY0021-12

lOOOOOOOOl Pin 1 index Feeding araed view Figure 7-4 Tape specifications © 2024-2026 FDK CORPORATION FDK CONFIDENTIAL 12

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Bluetooth® low energy module Datasheet HY0021-13

7.3 Dimensions of Embossed carrier tape Figure 7-5 Embossed carrier tape dimensions Figure 7-6 Reel dimensions

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Bluetooth® low energy module Datasheet HY0021-14

This product has obtained construction design certification as a radio station for low-power data communication system based on the Radio Law. This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Warning: Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment. The Integrator will be responsible...

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Bluetooth® low energy module Datasheet HY0021-15

8.1.2.7 FCC Statement (OEM) Integrator has to assure compliance of the entire end-product incl. the integrated RF Module. For 15 B (§15.107 and if applicable §15.109) compliance, the host manufacturer is required to show compliance with 15 while the module is installed and operating. Furthermore the module should be transmitting and the evaluation should confirm that the module's intentional emissions (15C) are compliant (fundamental / out-of-band). Finally the integrator has to apply the appropriate equipment authorization (e.g. Verification) for the new host device per definition in §15.101....

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Bluetooth® low energy module Datasheet HY0021-16

L’émetteur/récepteur exempt de licencecontenudans le présentappareilestconforme aux CNR d’Innovation, Sciences et Développementéconomique Canada applicables aux appareils radio exempts de licence. L’exploitationestautorisée aux deux conditions suivantes: (1) L' appareil ne doit pas produire de brouillage; (2) L' appareildoit accepter tout brouillageradioélectriquesubi, mêmesi le brouillageest susceptible d' encompromettre le fonctionnement. Caution: Exposure to Radio Frequency Radiation 1. To comply with the Canadian RF exposure compliance requirements, this device and its antenna must not be...

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Bluetooth® low energy module Datasheet HY0021-17

■ The contents of this document, including information on hardware, software, and systems (hereinafter referred to as "Products"), are subject to change without notice due to technological progress or other reasons. ■ Reproduction or reprinting of this material without our written consent is prohibited. Even if you reproduce or reprint this material with our written consent, please do not change or delete any of the contents. ■ Although we strive to improve the quality and reliability of our products, semiconductor and memory devices may be subject to malfunctions or failures. When using this...

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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.