ZIPLINE™ HIGH-DENSITY, HIGH-PERFORMANCE CONNECTOR SYSTEM DESCRIPTION BACKPANEL CONNECTORS The ZipLine™ connector system addresses customer demand for maximum signal density – a paramount requirement for future equipment platforms – at data rates up to 12.5 Gb/s. The initial ZipLine signal modules with 1.8mm column pitch support backplane and orthogonal midplane applications. A module with 72 differential pairs – consisting of 12 insert-molded leadframe assemblies (IMLAs), each supporting 6 high-speed differential signal pairs - provides the maximum density available by delivering 84.6 differential pairs per inch of card edge. Allowing a minimum 1-inch card slot pitch, the compact module dimensions help system designers address mechanical and thermal concerns. The 6-pair ZipLine signal IMLAs can also be configured on 1.5mm column pitch to provide more than 100 signal pairs per inch of card edge for even more backplane signal density. ZipLine connectors use FCI’s proven shield-less technology to deliver low insertion loss and crosstalk without using costly and space-consuming metal shields. Data rates can scale up to 12.5 Gb/s without requiring the redesign of a basic platform. In addition to offering superior signal density and electrical performance, the versatile ZipLine design allows for mixed differential (orthogonal or backplane), single-ended or power pin assignments within a connector. Another unique feature is a special power wafer, with up to 36A capacity, which can be integrated within a module. Complementary guide modules and high-power connector modules are also available. All ZipLine connectors and accessory modules are compatible with Hard Metric (HM) equipment design practice. FEATURES & BENEFITS Supports backplane and orthogonal midplane applications 6-pair modules with IMLAs on 1.8mm column pitch deliver 84.6 differential pairs per inch of card edge while allowing a minimum 1-inch card slot pitch 6-pair modules can also be configured on 1.5mm column pitch to provide >100 pairs per inch for even more density 3-pair configuration is under development to enable use on 15mm card slot pitch Provides maximum signal density available at data rates up to 12.5 Gb/s Use FCI’s shield-less technology to deliver low insertion loss and crosstalk Allows for mixed differential (orthogonal or backplane), single-ended or power pin assignments within a connector A special power wafer, with up to 36A capacity, can be integrated within a 6-pair module Compatible with Hard Metric equipment practice TARGET MARKETS / APPLICATIONS Communications • Routers • Switches • Networking • Access • Transport Data • Servers • Storage Systems Industrial • Medical • Test & Measurement

Application Description Vertical Header Right-Angle Receptacle Backplane 6 pairs/column x 12 columns (72 differential pairs), 2-wall header 10076197-101LF 10076209-101LF Backplane 6 pairs/column x 12 columns (72 differential pairs), 4-wall header 10080638-101LF 10076209-101LF Backplane 1 power wafer + 6 pairs/column x 11 columns (66 differential pairs), 2-wall header 10084166-101LF 10084164-101LF Backplane 2 power wafers + 6 pairs/column x 10 columns (60 differential pairs), 2-wall header 10084166-103LF 10084164-102LF Orthogonal Midplane 6 pairs/column x 12 columns (72 differential pairs), 2-wall...