Catalogs >
FCI >
Paladin® HD 112G Backplane Interconnect System

Paladin® HD 112G Backplane Interconnect System
2Pages

Catalog excerpts

Paladin® HD 112G Backplane Interconnect System - 1

Paladin® HD 112G Backplane Interconnect System DENSITY AND PERFORMANCE OPTIMIZED The Paladin® HD interconnect system provides world class bandwidth through industry leading density at 112Gb/s performance, supporting up to 144 differential pairs orthogonally within 1U spacing. Paladin HD utilizes a balanced pair structure; built with individually assembled and discretely shielded differential pairs which have a revolutionary hybrid board attachment for maximized density. The mating interface is designed to optimize space and eliminate the traditional orthogonal “twist”. Paladin HD utilizes a common mating interface between orientations and can support orthogonal and cable applications. § World class bandwidth with 144 orthogonal pairs within TARGET MARKETS § Industry leading transmission-to-crosstalk performance § Revolutionary hybrid board attach allows for flexible board routing § Impedance control over a 1.50mm connector de-mate FEATURES § World class orthogonal density § 144 differential pairs within 1RU card spacing, including room for airflow § Industry standard performance for 112G systems § More than 40dB IL to XTalk margin at 25GHz § Linear transmission beyond 40GHz § Hybrid board attachment with press-fit grounds § Optimized for maximum pair-to-pair density, signal and compression mount signals allow for traditional manufacturing processes § Maximized routing channels to minimize board layers integrity performance, and differential pair routing access at top layers of the board § 144 differential pair orthogonal can route in 6 high speed layers, up to 2 pairs per layer § Consistent Signal Integrity performance over the connector’s mechanical mating range § Mechanically matched and electrically balanced signals within each differential pair § Common and symmetrical mating interface § Less than 5Ω of impedance change while the connector is de-mated up to 1.50mm § Skew-less design with low mode conversion with conventional trace breakout § Supports Orthogonal applications in both 90° § Supports Orthogonal applications in both 90°/ 270° along with male and female cable § Leverages proven Paladin® differential pair architecture § Optimized reliability, robustness, quality, and real world 112G applications Amphenol Information Commu

Open the catalog to page 1

Paladin® HD 112G Backplane Interconnect System - 2

Paladin® HD 112G Backplane Interconnect System TECHNICAL INFORMATION MATERIAL § Contact Finish Area: Gold § Paladin HD Direct Orthogonal General Guidelines § Contact Base Metal: High performance copper alloy § Paladin HD Routing Guidelines § Housings: High performance engineering thermoplastic § Paladin HD General Product Specification ELECTRICAL PERFORMANCE § Paladin HD Daughtercard Press-Fit Installation Process § Signal Contact Current Rating: 0.5A § Paladin HD Daughtercard and Direct Ortho Module Removal and § Contact Resistance Change: 10mΩ max. § Dielectric Withstanding Voltage: 250V...

Open the catalog to page 2