HIGH POWER CONNECTORS HIGH POWER CARD EDGE (HPCE®) CABLE ASSEMBLY The HPCE® cable assembly is a next-generation power cable assembly for demanding applications requiring high linear current density and low power loss. It offers both one-piece (cable to card edge) and two-piece (cable to header) solutions. Both have a low profile height (7.5mm) and are based on very cost-effective and highly reliable stamped-and-formed power contact technology similar to other power solutions The HPCE® cable assembly incorporates an innovative power contact and housing design that permits a more compact and lower profile package for demanding AC and DC power distribution applications. HPCE® cable assembly offers low profile height (for maximized airflow), significantly increased linear current density and low contact resistance characteristics make it ideal for next generation 1U/2U servers, storage enclosures, telecommunications equipment FEATURES & BENEFITS Current rating of 36A for high power contact and 21A for low power contact (with multiple power contacts fully energized) without exceeding a 30°C temperature rise in still air Low profile height (7.5mm) maximizes airflow for effective system cooling Highly vented housing design maximizes heat Signal contacts are available for power control Number and placement of power and signal contacts are highly configurable for custom power needs Polarized housing option ensures proper mating board orientation for one-piece Integrated guide features make it ideal for blindmate applications for two-piece solution Robust design includes touch-proof safety features that are UL/IEC 60950 compliant Power & Signal First-Mate, Last-Break sequencing available for hot swap applications Various contact types to meet many power distribution applications: TARGET MARKETS / APPLICATIONS Data & Communications • AC/DC pluggable power supplies in data, telecom & datacom/networking equipment • Industrial controls & instrumentation

HIGH POWER CARD EDGE (HPCE®) CABLE ASSEMBLY TECHNICAL SPECIFICATIONS Contacts: High performance copper alloy Plating: Performance based plating at separable interface (Telecordia GR-1217 CORE Central Office) tin or tin-lead over nickel on press-fit tails Housings: High temperature thermoplastic, UL94-V0 RoHS information, this product is compatible according to the European Union Directive 2002/95/IEC Telcordia GR-1217-CORE Central Office qualification: MECHANICAL PERFORMANCE Nominal contact wipe distance • First Mate Power: 5.07 mm • First Mate Signal: 3.93 mm • Last Mate Power: 3.80 mm • Last...