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HIGH PIN COUNT (HPC) BACKPLANE CONNECTOR SYSTEM

HIGH PIN COUNT (HPC) BACKPLANE CONNECTOR SYSTEM

HIGH PIN COUNT (HPC) BACKPLANE CONNECTOR SYSTEM

Product catalog summary
Overview
The High Pin Count (HPC) Backplane Connector System is designed for robust mechanical and electrical performance, suitable for 3 and 4 row daughter cards interfacing with backplanes. It features guiding and keying for precise engagement and is comparable to High Density Interface (HDI) connectors. The system supports configurations from 30 to 600 positions, with custom options available for signal or power contacts. Key markets include communications, industrial, medical, and military electronics.

Features and Benefits
  • 0.025mm square posts and formed signal contacts ensure a rugged mechanical interface and excellent electrical performance.
  • Press-fit and solder tail options provide design and PCB assembly flexibility.
  • Custom configurations allow for tailored signal or power needs.

Technical Information
Materials
  • Housings: High-Temperature Thermoplastic, UL 94-V0
  • Contacts: Header and Receptacle made from high-performance CU alloy
Electrical Performance
  • Current Rating: 1A (all contacts powered), 2.25A (one contact powered)
  • Contact Resistance: <20 m ohms; Insulation Resistance: ≥ 500 M ohms
  • Signal Integrity: NEXT 10% Maximum
Mechanical Performance
  • Mating Force: <99 grams per contact
  • Un-mating Force: >18 grams per contact
  • Press fit Assembly: Seating force <40 lbs/contact; Un-seating >7.5 lbs/contact
  • Vibration and Mechanical Shock compliant with MIL-STD-202F

Specifications
Complies with Product Specification BUS-12-090.

Environmental
  • Operating Temperature: -40°C to +125°C
  • Thermal Shock: MIL-STD-202F compliant

Approvals and Certifications
  • UL94-VO: Flammability
  • UL-STD-498

Packaging
  • Tubes and Boxes

Target Market / Applications
  • Communications and Enterprise Systems
  • Industrial and Instrumentation
  • Medical Systems
  • Military Electronics

Part Numbers
Various configurations are available with specific part numbers based on plating options, number of positions, and tail length. For more information, contact [email protected] or visit www.fci.com.

Notes
  • X: Plating Options (1 = Gold, 5 = GXT™)
  • YYY: Number of positions
  • Z: Tail Length
  • GXT™ is a patented process of palladium-nickel alloy plated with a gold flash
See more

Catalog excerpts

HIGH PIN COUNT (HPC) BACKPLANE CONNECTOR SYSTEM-1

BACKPLANE CONNECTORS HIGH PIN COUNT (HPC) BACKPLANE CONNECTOR SYSTEM 0.100’’ (2.54mm) Pitch OVERVIEW The HPC connector is a traditional backplane interface providing rugged mechanical and electrical performance. It enables 3 and 4 row daughter cards to the backplane interface. On board connector guiding and keying are available to control and discriminate daughter-card engagement with the backplane card slot. The HPC connector compares with competitive High Density Interface (HDI) 4 Beam and Twin Beam Connectors (TBC). The square posts and formed signal contacts provide rugged mechanical interface and excellent electrical performance, while the receptacle contacts offer high reliability and low mating force. Even though standard connector sizes range from 30 to 600 positions, custom configurations are also available, with signal or power contacts. Primary markets served include Communications and Enterprise Systems, Industrial and Instrumentation, Medical Systems, Military Electronics, etc. •  0.025mm square posts and formed signal contacts •  Rugged mechanical interface •  Excellent electrical performance •  Press-fit and solder tail options •  Design and PCB assembly flexibility •  Connector sizes range from 30 to 600 positions •  Satisfies a variety of applications •  Custom signal or power configurations •  Allows custom configurations

 Open the catalog to page 1
HIGH PIN COUNT (HPC) BACKPLANE CONNECTOR SYSTEM-2

high pin count (HPC) BACKPLANE CONNECTOR SYSTEM technical information MATERIALS • Housings: High-Temperature Thermoplastic, UL 94-V0 • Contacts: Header: CU alloy, Receptacle: High performance CU alloy ENVIRONMENTAL • Operating Temperature: -40°C to +125°C ELECTRICAL PERFORMANCE • Thermal Shock: MIL-STD-202F, Method 107G • Current Rating (continuous): 1A (all contacts powered); 2.25A (one contact powered) • Electrical: Contact Resistance <20 m ohms; Insulation Resistance: ≥ 500 M ohms • Signal Integrity: NEXT (500ps rise time; S/G=2/1); 10% Maximum PACKAGING • Tubes MECHANICAL PERFORMANCE • Mating...

 Open the catalog to page 2

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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.