BOARD TO BOARD CONNECTORS GIG-ARRAY® CONNECTOR SYSTEM DESCRIPTION The GIG-ARRAY® connector is designed to meet the needs of up to 10Gb/s applications requiring up to 296 signal pins per connector. FCI’s long tradition as a BGA connector innovator assures expertise and reliability in the GIG-ARRAY® BGA design. The combination of multiple stack heights (15mm to 40mm) and multiple sizes (200 signals to 296 signals) utilizing a 100-Ohm differential matched impedance design allows for optimal design flexibility while yielding less than 1% cross-talk performance. FCI has produced BGA mezzanine connectors since 1996, shipping over 10 billion BGA contact interfaces demonstrating FCI’s extensive experience as the premier BGA interconnect innovator and supplier. FCI’s patented BGA design is supported by fully automated quality control systems featuring 100% inspections of assembly coplanarity, solder sphere size and location, as well as critical-to-function terminal component attributes. Multiple in-line vision systems, quality control product audits, and statistical process controls are all a part of our state-ofthe-art manufacturing facility. FEATURES & BENEFITS oHS compliant (Lead-Free) options are available R TARGET MARKETS / APPLICATIONS Communications • Transmission ptimized design for utilization in high-density, high-speed mezzanine O • Access applications • Switching all Grid Array (BGA) termination for process friendly attachment B • Optics mm x 0.65mm BGA interface pitch optimizes routing and electrical performance 1 • Networking tack Heights available from 15mm to 40mm provide mezzanine design S Data flexibility • Servers onnector sizes of 200 and 296 signals providing 62 signal contacts per • Storage C linear cm (158 signal contacts per linear inch) allow for optimization of I&I board space and signal requirements • Industrial controls & equipment 00 Ohm differential pair matched impedance assures consistent high 1 speed performance p to 10 Gb/s differential pair performance U ery low cross-talk (VLC) design of less than 1% allows for required V signal integrity performance D ual beam signal contacts provide two points of contact increasing product reliability olarized design assures proper mating of the connector P

GIG-ARRAY® CONNECTOR SYSTEM ELECTRICAL PERFORMANCE MATERIALS Housing: Liquid crystal polymer Contact: High-strength copper alloy Plating: GXT over Ni Solder sphere • SnPb: 63Sn/37Pb, 0.76mm diameter • b-Free: 95.5Sn/4Ag/0.5Cu, 0.76mm diameter P MECHANICAL PERFORMANCE urability: 25 cycles D ontact wipe: 2.00mm nominal C elcordia GR-1217-CORE T IPC-SM-785 Solder Joint Reliability Passed 6000 cycle solder joint reliability SPECIFICATIONS Product specification: GS-12-192 urrent rating (with ≤30°C temperature rise above C ambient) • 1A/contact with all contacts powered in 3 adjacent wafers • 3.5A/contact...

GIG-ARRAY* MATED HEIGHTS - BASE PART NUMBER SELECTOR 'Signal contacts only, ground contacts not included **Base part number listed under connector height Use web link www.fci.com/gigarray to obtain product drawings and additional technical information

GIG-ARRAY® CONNECTOR SYSTEM GIG-ARRAY® CONNECTOR SIZES Description Housing Length BGA Pad Length Number of Signal Contacts Number of Ground Contacts Number of BGA Balls Fully Shielded Differential Pairs Continuous Differential Pairs 200 Positions* 38.15 mm 31.85 mm 200 250 450 64 96 296 Positions* 53.75 mm 47.45 mm 296 370 666 96 144 GIG-ARRAY® INTERCONNECT PART SYSTEM PLUGS Number of Description Positions* 200 10mm 12mm 13mm 15mm 20mm 25mm 296 10mm 12mm 13mm 15mm 20mm 25mm Contact Area Finish Part Numbers (in microinches) SnPb BGA RoHS Compliant Pb-Free BGA 40 µin GXT 55737-001 55737-001LF 40...