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ExaMAX High Speed Backplane Connector System

ExaMAX High Speed Backplane Connector System

ExaMAX High Speed Backplane Connector System

Product catalog summary
Features & Benefits
  • Superior electrical performance at 25 Gb/s with scalability to 40 Gb/s.
  • Protected mating interfaces reduce damage risk.
  • Unique beam-on-beam interface improves crosstalk performance and eliminates insertion loss resonances.
  • Balanced differential pairs and optimized connector footprint reduce impedance discontinuities and crosstalk.
  • Options for 100Ω or 85Ω differential impedance.
  • Compact design with 2.00 mm for high linear signal density and wider column spacing for easier trace routing and increased bandwidth.
Target Markets / Applications
  • Communications: Switches, Routers, Optical Transport, Wireless Infrastructure.
  • Data: Servers, External Storage Systems, Supercomputers.
Description

The ExaMAX™ connector system is engineered for superior 25 Gb/s electrical performance, with a path to 40 Gb/s to meet increasing bandwidth and high-speed signaling demands. It features a beam-on-beam contact interface for improved signal integrity and low mating force. Protected mating interfaces prevent damage to the backplane and daughter card connectors. The design includes an embossed ground structure for enhanced crosstalk performance up to 40 Gb/s, offering a cost-effective solution for various system architectures.

Technical Specifications
  • Materials: High-performance copper alloy contacts, high-temperature thermoplastic housings.
  • Environmental: Telcordia GR-1217-CORE Central Office qualification pending.
  • Mechanical Performance: Mating force of 0.45 N max per contact, unmating force of 0.15 N min per contact, press-fit insertion force of 20 N max per contact.
  • Electrical Performance: Contact resistance of 10 mΩ max change after environmental exposure, current rating of 0.75 A/contact for signal and 2 A/contact for ground.
  • Signal Integrity Performance: IL < 1dB up to 20GHz, ΔIL < 1.5dB up to 20GHz, impedance options of 85Ω / 100Ω, compliant with OIF-25G-LR specification.

For more information, visit examax.fciconnect.com or contact [email protected].

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Catalog excerpts

ExaMAX High Speed Backplane Connector System-1

BACKPLANE CONNECTORS ExaMAX™ HIGH SPEED BACKPLANE CONNECTOR SYSTEM The ExaMAX™ connector system is designed to enable superior 25 Gb/s electrical performance and provide a path to 40 Gb/s in anticipation of further increases in bandwidth requirements and the data rates used for high speed signaling. ExaMAX™ connectors feature a revolutionary beam-on-beam contact interface that minimizes the residual stub for improved signal integrity performance compared to typical blade-on-beam contact structures and provides exceptionally low mating force while maintaining excellent contact normal force. Protected mating interfaces for both backplane and daughter card connectors also eliminates the exposed header pin field on the backplane, which can be susceptible to damage. Each signal wafer incorporates an innovative one-piece, embossed ground structure to improve crosstalk performance through 40 Gb/s. The simple, functional design contributes to a very cost-effective solution. The ExaMAX™ product family will address a broad range of system architectures, including backplane, midplane, midplane orthogonal, direct orthogonal, cabled backplane, coplanar FEATURES & BENEFITS Superior 25 Gb/s electrical performance with Protected mating interfaces on both the backplane and daughter card connectors reduces risk of damage Unique beam-on beam interface eliminates insertion loss resonances and improves crosstalk performance Balanced differential pairs Optimized connector footprint reduces impedance discontinuities and crosstalk 2.00 mm for highest linear signal density Wider column spacing option to ease trace routing and increase bandwidth Compact design provide low profile solution, minimal plug-in unit pitch for given TARGET MARKETS / APPLICATIONS • Optical Transport • Wireless Infrastructure • External Storage Systems

 Open the catalog to page 1
ExaMAX High Speed Backplane Connector System-2

ExaMAX™ HIGH SPEED BACKPLANE CONNECTOR SYSTEM TECHNICAL SPECIFICATIONS Contacts: High performance copper alloy Plating(s): Performance based plating at separable interface (Telecordia GR-1217 CORE) tin over nickel on press-fit tails Housings: High temperature thermoplastic, UL94-V0 ELECTRICAL PERFORMANCE Contact resistance: 10 mQ maximum change from initial reading after environmental exposure Current rating (with < 30°C temperature rise above ambient): signal contact: 0.75 A/contact - ground contact: Telcordia GR-1217-CORE Central Office qualification MECHANICAL PERFORMANCE Mating force: 0.45...

 Open the catalog to page 2

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