BOARD TO BOARD CONNECTORS High Density, Low Profile 1.00mm Pitch Mezzanine Connectors I - Series for Industrial Electronics Applications and Harsh Environments connector system provides a mechanically secure, high density electrical interface between parallel printed circuit boards. Conan's mechanical features and palladium/nickel/gold plated electrical contacts qualify it for high reliability use in durable electronic equipment and portable instruments. FEATURES & BENEFITS TARGET MARKETS / APPLICATIONS i "Snap" engagement contacts assure secure mating with an audible "click" i Blade-on-beam contact design allows "peeling" disengagement and prevents contact stubbing i Connector housings feature "lead-in" angles to i Surface mounted metal hold-downs reinforce connector retention to the printed circuit board i Mating polarization prevents backward connections i PCB polarization prevents errors during printed circuit board assembly i Pick and place caps with tape and reel packaging support automated assembly processes i Header height options support a range of PCB 19 part sizes: 9 to 69 contacts i Lead-free RoHS compatible products satisfy environmental regulations Industrial electronics Portable and mobile electronic equipment Motor vehicle Harsh Environments

High Density, Low Profile 1.00mm Pitch Mezzanine Connectors I - Series for Industrial Electronics Applications and Harsh Environments Contact base metal • Header: Phosphor bronze • Receptacle: Copper Alloy, High Spring Contact area finish: 0.38um (15uin.) GXT (Palladium- nickel alloy with gold flash) over 1.27um (50uin.) nickel Solder area finish: Pure tin over 1.27um (50uin.) nickel Housing material: Cream-colored LCP (UL 94V-0) ELECTRICAL PERFORMANCE Current rating: 1.0 amp continuous (per contact, all contacts powered) Signal Integrity (differential pairs, connector only) MECHANICAL PERFORMANCE...