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AirMax® High Speed Family

AirMax® High Speed Family
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BACKPLANE CONNECTORS AirMax® HIGH SPEED PRODUCT FAMILY Scalable performance to 25Gb/s OVERVIEW AirMax® family of connectors address the industry needs for high bandwidth applications requiring a scalable migration path to 25Gb/s data rate. This innovative edgecoupled connector utilizes a shieldless design with an air dielectric between conductors. AirMax® technology delivers signal densities up to 63.5 differential pairs per inch while exhibiting low insertion loss and low crosstalk, allowing signals to scale differential signals up to 25Gb/s. Breaking the dependence on metal shields to accomplish excellent high speed electrical performance also provides incredible design flexibility. Individual contacts in a connector module are able to be allocated to differential signal pairs, single-ended signals or low-level power as dictated by the system need. The standard 2.0mm column spacing can be easily increased to 3.0mm enabling signal traces to be routed on a board layer, trading some signal density for reduced layer count and lower board cost for those applications that do not demand maximum signal density. The AirMax ® system also provides flexibility in the number of differential pairs per column to address card slot pitch, connector profile or airflow requirements. AirMax® extensive product variations accommodate a wide range of industry standard applications commonly used in backplane, midplane, coplanar, mezzanine, Cable-ToBoard, and orthogonal midplane architectures. • Provides a scalable migration path to 25Gb/s per differential pair • Scalable system architecture without costly redesign • Innovative shieldless edge couple technology and air dielectric between adjacent conductors • Superior electrical performance delivering low crosstalk and insertion loss • Open Pin field design • Maximizes pin assignment flexibility • Backward mating-compatible interface • Enables easy migration path to previous generation systems • Hard metric design • Flexible design for low speed signals, power and guidance components. • 3.0mm column pitch for Quad PCB routing • Reduces PCB layer count via quad routing the signal tracess • Contains no interleaving shields • Reduces connector cost, weight, and PCB routing complexity

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AirMax® HIGH SPEED PRODUCT FAMILY AirMax® PRODUCT FAMILY COMPARISON AirMax® Product Family 1. AirMax VSe® extends system performance to 25Gb/s by utilizing an innovative ECB (Electrical Conductive Bar) imbedded in the mechanically robust connector system. Bifurcated contact beams in the receptacle mating interface delivers proven reliability with two points of contact to the header pin. 2. AirMax VS2® extends system performance to 20Gb/s in a mechanically robust connector system. Bifurcated contact beams in the receptacle mating interface delivers proven reliability with two points of...

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AirMax® HIGH SPEED PRODUCT FAMILY TECHNICAL INFORMATION MATERIALS • Contacts: Copper Alloy • Telcordia GR-1217-CORE Central Office • Contact Finish: • Performance-based plating over nickel at the separable interface • Tin over nickel on press-fit tails on standard lead-free products. Tin-lead option available upon request. CONNECTOR DENSITY • Housings: High Temperature Thermoplastic, UL94V-0 ELECTRICAL PERFORMANCES • Contact Resistance: ≤35 mΩ initial, ≤10 mΩ increase after environmental test Minimum Card Slot (mm) Differential Pairs Column Pitch Linear Density per column per inch per cm...

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AirMax® HIGH SPEED PRODUCT FAMILY AirMax VSe® and VS2® 1. Flat housing and closed lead frame design for maximum mechanical robustness 2. Standard flat rock tooling for connector PCB insertion 3. Backwards mating compatible to AirMax VS® 4. AirMax VS2® is PCB footprint compatible to AirMax VS® 5. Connector Height: 11.5mm AirMax VS® supports open lead frame design For more information, please contact: Communications@fci.com or visit us at www.fci.com Disclaimer Please note that the above information is subject to change without notice.

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□ AirMax® HIGH SPEED PRODUCT FAMILY BOARD FOOTPRINT COMPARISON The AirMax VSe® and VS2® footprint are very similar to the original AirMax VS® Layout. The only changes are in the signal hole diameters and the optional row of vias. For enhanced Signal Integrity properties, no pins are assigned to these vias. 0 0.50mm Signal and Ground vias RECEPTACLE CONTACT DESIGN COMPARISON Mating beams have 1 point of contact on each side of each header blade (2 points of contact for each header blade) Mating beams have 2 points of contact on one side of each header blade (similar to most backpanel...

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