Laser Drives Flexible Electronic Devices to Maturity Recently, US Patent and Trademark Office grant Apple Inc a new patent——flexible or folding iPhone in future. Experts say that electronic equipment flexibility will be the future trend. HGLASET FPC flexible circuit board laser cutting technology, FPC flexible circuit board laser welding technology, LDS laser direct forming technology and light guide plate laser marking technology always ready to meet the arrival of the flexible industrial revolution. The HGLASER-developed FPC laser cutting machine can make automated precision cutting. Compared with traditional mechanical stamping, laser processing can process edge perfectly with 3cm/s without any material. In addition, QR code will be marked while cutting so as to realize the system trace. In industrial 4.0 era, smartphone has developed more portable. Flexible electronic device will pursue space-saving in the future. It will be regular that welding wire on flexible circuit board or connecting other flexible circuit board plug-in. It just takes 0.5 second to weld a point for FPC welding technology.

The most critical part of flexible electronic device is flexible screen. With cutting, welding, laser direct structuring technologies, folding and deformation won’t damage the internal components of FPC. However, how to distribute light source uniformly has become the key problem of flexible screen. Only with ultrafast laser, focus smaller light spot on one thousandth of a strand of human hair diameter and emit points regularly on light guide plate, in this way can light source be dispersed regularly. In early 2010, Korean company LG has launched flexible e-book screen. In 2013, International...

displayed a flexible mobile phone screen. Intel and PlasticLogic displayed flexible screen tablet. In the near future, television will as thin as paper, mobile phone can be worn on hand, tablet PC can be bend into small piece in pocket.