Innovation Fuels a Better World HGSTAR GLASS PROCESSING SOLUTIONS HG STAR TECHNOLOGY CO.,LTD. Headquarters Address: HGTECH Intelligent Manufacturing Industrial Park, No. 66, Weilai Road (No. 2), East Lake High-tech Development Zone, Wuhan, Hubei Province, China. Postcode：430223 Tel：+86-27-87180225 E-mail：[email protected] After-es：+86-27-87180253 Website：www.hglaserglobal.com Export Industrial Base: Huagong Technology Intelligent Manufacturing Export Industry Base, Jinan, Shandong, China. Email: [email protected]

Glass Cutting/Breaking All-in-One Machine Ultrafast Infrared Picosecond Laser Cutting Technology Smart HGCS5050 is a new-generation intelligent laser cutting and breaking all-in-one machine launched by HG Star for the high-end precision glass processing market. The system utilizes infrared picosecond ultrafast laser technology for high-quality, non-contact cutting, and integrates a built-in CO2 laser breaking system to achieve precise separation. It combines both cutting and breaking functions in a single unit, supporting independent or synchronized operation. Machine is widely used in high-precision...

All-in-One Glass Sandblasting / Paint Removal / Drilling Machine Smart HGM is a new-generation intelligent laser processing machine independently developed by HG Star, specifically designed for precision machining of coated glass, lenses, and specialty glass. Precision Laser Control This system integrates laser sandblasting, coating removal, and glass drilling into one unit, replacing traditional frosting and sandblasting processes. It enables a one-pass, green, and consumable-free processing mode, offering high efficiency and environmental benefits. Equipped with HUARAY MOPA laser with stable output...

Application Industries HG Star all-in-one glass cutting and breaking machine is widely used in high-precision processing of advanced glass materials across various industries such as consumer electronics, optical components, semiconductor carriers, display panels, precision glass, glass cover plates, and 3C electronic components. It is suitable for cutting, breaking, and edge processing of ultra-thin glass, tempered glass, flexible glass, sapphire, quartz glass, and ceramic substrates. Domestic industrialization of ultrafast lasers Laser+Intelligent Manufacturing Laser drilling for microfluidic...