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DUAL COOL PACKAGE POWERTRENCH® MOSFET

DUAL COOL PACKAGE POWERTRENCH® MOSFET
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DUAL COOL PACKAGE POWERTRENCH® MOSFET - 1

DUAL COOL PACKAGE POWERTRENCH® MOSFET Dual CoolTM packaging technology, provides both bottom and top-side cooling in a PQFN package. Not only is the PQFN footprint an industry standard, it provides the designer with performance exibility. With enhanced dual path thermal performance and improved parasitics over its wire-bonded predecessors, the use of a heat sink with Dual Cool packaging technology provides even more impressive results. Test results prove that, when a heat sink is used with our Dual Cool package technology, synchronous buck converters deliver higher output current and increased power density. With Fairchild’s trench silicon technology, Dual Cool packaging technology proves to be a clear leader in power density and thermal performance. Our Dual Cool package solutions are lead free and RoHS compliant and are available in 3.3mm x 3.3mm and 5mm x 6mm PQFN packages. Features Maximum Power Dissipation • Top-side cooling, lower thermal resistance from junction to top • Same land pattern as 5mm x 6mm and 3.3mm x 3.3mm PQFN – JEDEC standard Capable of >60% Better Thermal Performance Dual Cool Package 3.3mm x 3.3mm • Allows higher current and power dissipation • Highest power density for DC-DC applications • Use with or without a heat sink, reduces the number of qualied components in the BOM Standard PQFN • Multiple suppliers without cross licensing requirements • High degree of production commonality with standard PQFN packaging • 25V - 150V portfolio Applications • Point-of-Load (POL) synchronous-buck conversion • Servers (%) Improvement from Wire Package PQFN Wire PQFN Clip Dual Cool Package • Telecommunications, routing and switching • Heat path from top only Environment: Minimum Pad, Heat Sink, 200LFM Forced Air

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DUAL COOL PACKAGE POWERTRENCH® MOSFET - 2

DUAL COOL PACKAGE POWERTRENCH® MOSFET Top 1-Phase CCM with Heat sink and Forced Air 200LFM Dual Cool Package Dual Cool Package 3.3mm x 3.3mm Competitor Package Competitor % Difference Solderable Area Total Component Area (Max) Board Solderable Component Area Dual Cool Package (3.3mmx3.3mm) 5mm x 6mm Package Part Number SyncFETTM Technology SyncFETTM Technology 3.3mm x 3.3mm Package Part Number For more information on Dual Cool packaging, please visit fairchildsemi.com/dualcool Silicon Valley Headquarters Corporate Offices Fairchild Semiconductor Fairchild Semiconductor GmbH Fairchild...

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