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EASYLOG - Wireless Temperature Measurement during the Pressing of Thin Panels

EASYLOG - Wireless Temperature Measurement during the Pressing of Thin Panels

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EASYLOG - Wireless Temperature Measurement during the Pressing of Thin Panels

Product catalog summary

Technical Specifications

Data Logger: Dimensions are 64 x 43 x 2.5 mm, powered by 3.0 V, with programmable measurement intervals starting at 0.25 seconds.
Digital Temperature Sensor: Measures up to +125 °C with an accuracy of +/-2 °C, suitable for panel thicknesses of at least 10 mm, using a radio frequency of 13.56 MHz (RFID).
Reader: Dimensions are approximately 275 x 204 x 27 mm, weighs about 1.1 kg, features a 10.1” display with 1366 x 768 resolution, 2 GB working memory, and 32 GB hard disk.

References: Applicable for manufacturers of particleboard, OSB, MDF, insulating materials, OEMs, resin producers, and research institutes.

Wireless Temperature Measurement for Optimum Pressing Process
The EASYLOG system optimizes the pressing process by recording mat temperature during pressing, suitable for panels with a minimum thickness of 10 mm. It provides insights into resin curing, allowing for press program optimization and immediate detection of quality impacts from various parameters such as moisture, glue structure, and raw density. The system supports temperature measurement in downstream processes like cooling and coating, using long-life batteries and programmable phases. Data loggers are controlled via a tablet PC, and data is wirelessly transferred for evaluation.

Measuring Procedure

Place the logger in the core layer of the wood-based mat.
Mark the logger's position on the mat edge.
Continuously measure temperature through the hot press.
Synchronize measurement with press inlet and outlet.
Wirelessly read out the data logger.

Benefits

Provides information on resin curing and reaching the 100 °C threshold.
Reduces start-up times for wood-based panel production.
Optimizes existing press programs and adapts recipes quickly.
Detects influences of upstream and downstream processes.
Suitable for panels over 10 mm thickness, with a small logger thickness of 2.5 mm.

Why GreCon

Measures temperature in any press position with exact core layer measurement.
Features safe, easy handling and wireless data transfer via RFID.
Intuitive touch display and supports multiple simultaneous measurements.
Enables long-term measurements in downstream processes.

Catalog excerpts

EASYLOG - Wireless Temperature Measurement during the Pressing of Thin Panels-1

References ■■ Particleboard, OSB, MDF manufacturers ■■ Insulating material manufacturers (up to 125 °C) ■■ Original equipment manufacturers (OEM) ■■ Resin producers ■■ Research institutes Fagus-GreCon Greten GmbH & Co. KG P.O. Box 1243 D-31042 Alfeld-Hanover Phone Fax E-Mail Wireless Temperature Measurement during the Pressing of Thin Panels Fire Protection Measuring Technology EN | R.02 | 2015.04 Subject to technical and country-specific modifications. © Fagus-GreCon Greten GmbH & Co. KG

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EASYLOG - Wireless Temperature Measurement during the Pressing of Thin Panels-2

Your Benefit ■■ Information on the curing of the resin in the panel (reaching of the 100 °C threshold in any position) ■■ Short start-up times of wood based panel productions ■■ Optimisation of existing press programs ■■ Recipe adaptations in record time ■■ Detection of influences of upstream and downstream processes ■■ Small thickness (2.5 mm) ■■ Suitable for panels of more than 10 mm thickness ■■ Temperature measurement during cooling, conditioning, sanding, coating ■■ Temperature measurement in any position within the press ■■ Exact measurement in the core layer ■■ Safe and easy handling ■■...

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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.

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