PRODUCT FEATURES High-density cooling (65kW). specifically designed for liquid cooling heat dissipation of GPU servers. 6U rack-mounted, highly integrated, significantly saving data center space. High-efficiency liquid-to-liquid heat exchange, rapidly transferring heat to PCW with exceptional efficiency. Green energy-saving with precise power control, significantly optimizing data center PUE. N+N high-reliability pump and power redundancy design, ensuring uninterrupted operation. Precision intelligent temperature control with real-time sensing and adjustment, maintaining optimal coolant temperature....

This system consists of two coordinated liquid cooling loops that share PCW (Process Cooling Water) from the facility side. Liquid-Cooled Rear Door RDHx Low-Temperature Loop (Managed by RDHx Itself) This solution combines chip-level high-efficiency heat dissipation with cabinet-level residual heat capture, creating a "thermal neutral" cabinet-level full liquid cooling system. Liquid-to-Liquid CDU: Via D2C (Direct-to-Chip liquid cooling), precisely and efficiently removes extreme heat from core components such as CPUs/GPUs * (accounting for 70-80% of total power consumption). # RDHx Liquid-Cooled...