PLAN PRODUCT FEATURES # Active Heat Dissipation, Equipped with fans or pumps to force airflow through heat exchangers, removing server heat more effectively. - 13kW High-Efficiency Cooling, Air-liquid hybrid oooling, ideal for me* dium-to-high density equipment. Intelligent Frequency Conversion & Precise Temperature Control, En- * sures stable operation and reduces energy consumption. Designed for traditional air-cooled computer rooms, this solution allows the deployment of AI/GPU servers without any modifications to the existing infrastructure. Eliminating the need for complex external cold...

This solution is a highly integrated chip-level liquid cooling system. Its core value lies in perfectly combining the exceptional heat dissipation efficiency of liquid cooling with the excellent compatibility of air-cooled data centers, via the key carrier of a "liquid-to-air" rear door.For scenarios requiring an upgrade to ultra-high-density servers, yet constrained by existing air-cooled infrastructure, it represents the optimal retrofitting path that delivers both economic efficiency and practicality. I 'Cooling Capacity per Cabinet^! RDHx Liquid-Cooled Rear Door