Group: EVIDENT
Catalog excerpts
Eddy Current and Bond Testing Flaw Detector OmniScan MX with ECA/ECT Modules Discover Eddy Current Color Imaging • Large, high-resolution and full-color display in a portable format • Eddy current array made easy • Replacement for traditional NDT methods • Analysis and archiving • Bond testing C-scan
Open the catalog to page 1The OmniScan MX A Field-Proven, Dependable Instrument With thousands of units being used throughout the world, the OmniScan® MX is a field-proven, reliable instrument that is built to withstand harsh and demanding inspection conditions. Compact and lightweight, its two Li-ion batteries provide up to 6 hours of manual or semi-automated inspection time. The highly legible 8.4 in. (213 mm) real-time color display of the OmniScan MX enables you to see defects and details under any light conditions. Navigate your way through the instrument’s simple and intuitive interface using the scroll knob...
Open the catalog to page 2One Platform, Two Modules, Three Technologies: More Flexibility To meet the requirements of a broader range of applications, eddy current testing (ECT), eddy current array (ECA) and the new bond testing (BT) C-scan technology are available in two module versions. Both of these modules are compatible with the MXE (ECT/ECA) and MXB (BT C-scan) software, providing easy transition between technologies and a very short learning curve. Eddy Current Array Bond Testing C-Scan Most Nortec probes supported Supports 32 onboard channels and 64 channels with external multiplexer Requires special adaptor...
Open the catalog to page 3ECA is just like ECT Large Coverage, Fast Scanning, and Higher Probability of Detection Eddy current array (ECA) technology incorporates several traditional bridge or reflection (driver-pickup) probe coils in order to achieve a much larger coverage in a single inspection pass. Additionally, each ECA probe model is carefully designed to maintain a high probability of detection of a targeted defect range, all along the probe length. With the OmniScan® MX ECA, you can use ECA probes at fast manual-inspection speeds, offering a powerful and productive inspection with color representation and...
Open the catalog to page 4Increased Power, Decreased Complexity MXE 3.0 Software With the exception of the added capacity to electronically switch between elements, eddy current array (ECA) technology is essentially the same as ECT technology. Eddy current array is easy to operate and calibrate. The new OmniScan MXE 3.0 ECA software has been redesigned to facilitate the transition from a conventional ECT instrument (such as the Olympus Nortec® 500) and to offer the power of ECA in a much more accessible way. Nortec 500 Main menu OmniScan MXE 3.0 new Main menu Live Impedance Plane Calibration of ECA is done in a...
Open the catalog to page 5Encoded Scans for Easier Data Interpretation Optimized 1-2-3 Calibration The OmniScan® MX ECA not only displays ECA signals in a conventional ECT impedance plane view but also offers several other views and layouts where the user will begin to recognize the true power of encoded ECA technology. These displays can be made part of the calibration workflow and can make eddy current testing highly visual and even go/no-go, based on user defined acceptance criteria. Thanks to its intuitive interface design, the OmniScan MX ECA is quick and easy to configure and operate. It is as simple as one,...
Open the catalog to page 6Powerful Color Imaging Estimation of Flaw Depth with Color-Coded C-Scans As with conventional eddy current technology, flaw severity is closely correlated to the return EC signal amplitude in most surface or near-surface applications. By using an amplitude-based color code, and plotting each channel’s return signal with encoded-position information, the resulting C-scan display is highly visual and intuitive. These scans can be saved to the removable CF card or generated into a report onboard the OmniScan® MX. A reference standard with known depth defects is necessary to calibrate the...
Open the catalog to page 7Replacement of Traditional NDT Methods Paint Removal is Obsolete Eddy current array has a unique ability to perform inspections through thin coatings on conductive material. This capability provides a tremendous advantage over existing methods, such as penetrant testing, magnetic particle or magneto-optical imaging (MOI), as the need to remove and then reapply paint or coating is eliminated completely. Over time, this provides you with enormous cost-savings, and most importantly, your inspections will be chemical-free. Part inspected with Penetrant Testing (visible red dye) Scan using a...
Open the catalog to page 8Analyzing, Reporting, and Archiving Confirm or Revisit Inspections after Completion Even after an in-field inspection has been completed, the OmniScan® MX ECA continues to provide value thanks to integrated data-storage, analysis, and reporting functionalities. With the OmniScan MX ECA you can review individual indications and apply corrections as needed. The new MXE 3.0 ECA software features newly redesigned, intuitive data cursors that can be operated directly from the instrument (on-site) or with a mouse connected by USB (office use). New MXE 3.0 selection cursors are very intuitive and...
Open the catalog to page 9OmniScan MX in ECT Mode, a Powerful Flaw Detector Some inspection procedures may specifically require ECT while ECA can easily help you cut time and find proPlem areas. With the OmniScan® MX ECA, you don't need to commit to just one technology at the start of an inspection. Pressing and holding the menu key anytime during an in- spection allows for instant switching Petween ECA and ECT modes. Both proPes can remain connected and configura- tion setups remain active. Simultaneous connection of ECA and ECT probes provides the best tool for the job without the need to stop and reconfigure your...
Open the catalog to page 10Bond Testing Imaging Ready for the Composite Era As composite materials are increasingly engineered into structural and critical components, validating their integrity beyond traditional tap testing has become a necessity. By offering the ability to drive Olympus BondMaster® pitch-catch probes, both of the OmniScan MX modules help meet this rising demand. The use of bond testing (BT) technology on the OmniScan MX ECA/ECT instrument is made possible by the shared similarities between BT and ECT technologies. In addition to an Olympus X-Y scanning device, the BT C-scan mode requires an...
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