EVG Product Range Brochure
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Product Range

About EVG EV Group (EVG) is a leading supplier of high-volume production equipment and process solutions for the manufacture of semiconductors, MEMS, compound semiconductors, power devices and nanotechnology devices. A recognized market and technology leader in wafer-level bonding and lithography for advanced packaging and nanotechnology, EVG’s key products include wafer bonding, thin-wafer processing and lithography/nanoimprint lithography (NIL) equipment, photoresist coaters, as well as cleaning and inspection/metrology systems. With state-of-the-art application labs and cleanrooms at its...

Core Technologies For nearly 40 years, EVG has provided industry-leading process technologies and solutions that have enabled innovations in advanced packaging, optics and photonics, sensors and bio-medical devices and applications. True to our Triple-i philosophy of “Invent”, “Innovate” and “Implement”, our core lithography, wafer bonding and metrology technologies enable manufacturers to develop the latest micro- and nanotechnology device breakthroughs, and then bring them into high-volume production, cost effectively and at high process yields. Nanoimprint Lithography (NIL) SmartNIL®...

Wafer Bonding With extensive experience in designing and manufacturing precision wafer bonding equipment, EVG is well recognized for setting industry standards in wafer bonding. EVG wafer bonding systems can be configured for R&D, pilot-line or high-volume production, and for any direct or interlayer-based bonding process, including sophisticated low-temperature covalent bonding. With this portfolio of technologies and equipment, EVG addresses markets for advanced packaging and 3D integration, MEMS, as well as advanced compound semiconductor and SOI substrates, holding the leading position...

Lithography EVG’s key competencies in lithographic technology lie in the high-throughput contact and proximity exposure capabilities of its mask aligners and the in-house process knowledge of its resist processing systems. All of EVG’s lithography equipment platforms are 300-mm ready, can be fully integrated into its HERCULES® lithography track systems, and are complemented by its metrology tools for top-to-bottom side alignment verification. EVG constantly looks ahead to future market trends and thus provides application-specific solutions, particularly in the optical 3D sensing and...

Mask Alignment Systems EVG®610 Mask Alignment System up to 200 mm EVG®620 NT Mask Alignment System (semi-automated / automated) up to 150 mm Resist Processing Systems EVG®101 Advanced Resist Processing System up to 300 mm UV Nanoimprint Lithography / SmartNIL® Systems HOGRAPHY OGRAPHY LITHOGRAP APHY EVG®610 UV-NIL System up to 150 mm EVG®620 NT SmartNIL® UV-NIL System up to 150 mm UV Nanoimprint Lithography / SmartNIL® Systems HOGRAPHY LITHOGRAPHY HERCULES® NIL Fully Integrated SmartNIL® UV-NIL System up to 200 mm HERCULES® NIL Fully Modular and Integrated SmartNIL® UV-NIL System up

EVG®6200 NT Mask Alignment System (semi-automated / automated) up to 200 mm IQ Aligner® Automated Mask Alignment System up to 200 mm IQ Aligner® NT Automated Mask Alignment System up to 300 mm Lithography Track Systems EVG®120 Automated Resist Processing System up to 200 mm EVG®150 Automated Resist Processing System up to 300 mm EVG®6200 NT SmartNIL® UV-NIL System up to 200 mm EVG®720 Automated SmartNIL® UV-NIL System up to 150 mm IQ Aligner® Automated UV-NIL System up to 300 mm HERCULES® Lithography Track System up to 300 mm EVG®7200 Automated SmartNIL® UV-NIL System up to 200 mm EVG®7200...

Permanent Bonding Systems EVG®501 / EVG®510 Wafer Bonding System up to 200 mm EVG®520 IS Wafer Bonding System up to 200 mm EVG®540 Automated Wafer Bonding System up to 300 mm EVG®560 Automated Wafer Bonding System up to 300 mm EVG®850 TB Automated Temporary Bonding System up to 300 mm EVG®850 DB Automated Debonding System up to 300 mm Temporary Bonding and Debonding Systems Bond Alignment Systems EVG®6200∞ BA Automated Bond Alignment System up to 200 mm Fusion and Hybrid Bonding Systems SmartView® NT Automated Bond Alignment System for Universal Alignment up to 300 mm EVG®301 Single Wafer...

ComBond® Automated High-Vacuum Wafer Bonding System up to 200 mm GEMINI® Automated Production Wafer Bonding System up to 300 mm EVG®610 BA Bond Alignment System up to 200 mm EVG®620 BA Automated Bond Alignment System up to 150 mm Bond Alignment Systems BONDING BONDING BON BONDING BONDING BONDIN EVG®810 LT LowTemp™ Plasma Activation System up to 300 mm EVG®850 LT Automated Production Bonding System for SOI and Direct Wafer Bonding up to 300 mm EVG®40 NT Automated Measurement System up to 300 mm EVG®50 Automated Metrology System up to 300 mm

Process Technology With state-of-the-art application labs and cleanrooms at its headquarters in Austria, as well as in the U.S. and Japan, EVG is focused on delivering superior process expertise to our global R&D and production customer and partner base. Our process development teams work hand-in-hand with customers, from the initial process development through to the final integration at their production sites. Services range from equipment demonstrations and feasibility studies to small-tomedium-scale pilot-line production to shorten time to market. Last but not least, EVG’s process...

Customer Support Customer satisfaction is critically important for EVG. Our worldwide customer support centers and spare parts supply network deliver on our commitment to provide on-demand, quality service that our local customers and partners have come to expect from EVG. With outstanding experience and knowledge, our team is ready to provide you with immediate assistance through remote diagnostics and on-site service with extremely short response times around the globe. In-depth knowledge allows you to unlock the full potential of your EVG equipment. Our state-of-the-art training center...