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EVG®770 NT

EVG®770 NT

Product catalog summary
Introduction
The EVG770 NT is a step-and-repeat nanoimprint lithography system designed for efficient master fabrication and direct patterning of complex structures on substrates. It supports uniform replication of templates from small dies up to 30 cm² and can handle large areas up to Gen2 panel-size substrates. This system is essential for high-volume manufacturing in applications such as augmented reality waveguides, optical sensors, and biomedical devices.

Features
  • High-quality master fabrication for microlenses and nanostructures.
  • Scalable to large substrate sizes up to panel size.
  • Supports various master types and resist dispense modes.
  • Live imaging during dispensing, imprinting, and demolding.
  • In-situ force control and optical distance control with live gap measurement.
  • Optional in-line metrology, stamp buffer, and automated cassette handling.

Technical Data
  • Available substrate sizes: 80 mm, 4”, 6”, 8”, 12”, Gen2 (370 mm x 470 mm).
  • Die-to-die positioning accuracy: < +/- 1 µm.
  • Live alignment accuracy: < +/- 250 nm.
  • Maximum template size: 80 mm x 80 mm.
  • Active imprint area: 30 cm².
  • LED exposure optics wavelength: 365 nm.
  • Exposure optics intensity: > 300 mW/cm².
  • Dispense viscosity range: 100-10000 cp.
  • Dispense system material compatibility: IPA, PGMEA, MEK, Acetone.
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Catalog excerpts

EVG®770 NT-1

EVG®770 NT Step-and-Repeat Nanoimprint Lithography System Introduction Features Step-and-Repeat Nanoimprint Lithography for Efficient Master Fabrication The EVG770 NT is a versatile platform for step-and-repeat (S&R) nanoimprint lithography for efficient master fabrication or direct patterning of complex structures on substrates. This approach allows uniform replication of templates from small dies up to 30 cm2. The S&R process allows to replicate those dies multiple times over large areas up to Gen2 panel-size substrates. In combination with diamond turning or direct writing methods, S&R imprinting is frequently used to efficiently fabricate masters required for wafer-level optics manufacturing or EVG's SmartNIL process. Thus, it is often a crucial prerequisite for high volume manufacturing of augmented reality waveguides, optical sensors, diffractive optics, metasurfaces or biomedical devices. Key features of the EVG770 NT include precise alignment capabilities, full process control and the flexibility to address process requirements of a wide variety of structures and materials. Technical Data High-quality master fabrication of microlenses for wafer-level optics down to nanostructures for SmartNIL® Efficient scaling to large substrate sizes up to panel size Simple implementation of different types of masters Variable resist dispense modes Live image during dispensing, imprinting and demolding In-situ force control for imprinting and demolding Optical distance control and live gap measurement Optional in-line metrology Optional stamp buffer and automatic exchange Optional automated cassette-to-cassette handling Contact EV Group Europe & Asia/Pacific GmbH DI Erich Thallner Strasse 1 4782 St. Florian am Inn Austria +43 7712 5311 0 Printed on paper from sustainable sources. Data, design and specifications may not simultaneously apply; or depend on individual equipment configuration, process conditions and materials and may vary accordingly. EVG reserves the right to change data, design and specifications without prior notice. All trademarks, logos, website addresses or equipment names are registered trademarks and/or the property of EV Group or their respective owners. © EV Group (EVG). All rights reserved. V21/01

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