Product Range

Process Development and Services With state-of-the-art application labs based at its headquarters in Austria, as well as in the U.S. and Japan, EV Group (EVG) is focused on delivering superior process expertise to its growing global customer base - from the initial development until the final integration at the customer’s site. Featuring state-of-the-art cleanrooms and a highly experienced staff of process and application engineers, the company's process development business unit works hand in hand with customers on a number of areas. These advanced process development and application labs are...

PERMANENT WAFER BONDING The introduction of EV Group's wafer-bonding approach, which separates the bond alignment from the bonding step, immediately revolutionized the market. Utilizing high-contact forces under elevated temperatures and a controlled atmosphere, this novel approach is today's process standard, with EV Group holding the dominant market share for both semi- and automated wafer bonding systems and a growing install base of more than 1100 bond chambers. Regarding systems applying low-contact forces under room temperature at utmost clean conditions, EV Group is also leading the market....

WAFER BONDING SYSTEMS EVG®501 Wafer Bonding System up to 200 mm EVG®510 Semi-automated Wafer Bonding System up to 200 mm EVG®520 IS Semi-automated Wafer Bonding System up to 200 mm EVG®540 Automated Wafer Bonding System up to 300 mm EVG®540C2W Automated Wafer & Chip-to-Wafer Bonding System up to 300 mm EVG®560 Automated Wafer Bonding System up to 200 mm EVG®560 Automated Wafer Bonding System up to 300 mm ComBond® Automated High-Vacuum Wafer Bonding System up to 200 mm EVG®6200∞ Semi-automated Bond Alignment System up to 200 mm SmartView® NT Automated Bond Alignment System for Universal Alignment...

Application Examples The different drivers for employing wafer bonding, as well as the applications served by EV Group bonding technology, are as diversified as the markets from which these applications originate. Product Wafer Adhesive Carrier Wafer Cross-section of temporary bond utilizing Brewer Science®'s HT series adhesive Source: EVG 8-layer direct bond cross-section Courtesy of MIT SOI wafers produced utilizing SmartCut® technology Courtesy of Soitec Glass-frit bond interface Courtesy of ST Microelectronics Ziptronix direct bond Interconnect Courtesy of Ziptronix Metal/Adhesive via first...

LITHOGRAPHY Since introducing the industry's first backside-alignment microscope on a proximity mask alignment system more than two decades ago, EV Group has been committed to pioneering advances in lithography for semiconductor and MEMS manufacturing. The company's key competencies in lithographic technology lie in the high-throughput contact and proximity exposure capabilities of its mask alignment systems (EVG600, EVG6000 and IQ series) and in its highly integrated coating platform (EVG100 series). All of EV Group's lithography equipment platforms are 300 mm ready, can be fully integrated...

MASK ALIGNMENT SYSTEMS EVG®620 NT Automated Mask Alignment System up to 150 mm EVG®620 Semi-automated Mask Alignment System up to 150 mm EVG®610 Semi-automated Mask Alignment System up to 200 mm EVG®6200∞ Automated Mask Alignment System up to 200 mm EVG®620HBL Automated Mask Alignment System up to 150 mm LITHOGRAPHY TRACK SYSTEMS EVG® 6200NT Semi-automated Mask Alignment System up to 200 mm HERCULES® Lithography Track System coat, UV-exposure and develop modules up to 300 mm IQ Aligner® NT Automated Mask Alignment System up to 300 mm HERCULES® L Lithography Track System resist processing & expose...

Application Examples WAFER BONDING SYSTEMS Advanced Lithography EV Group's solutions enable a broad range of applications that are key in the manufacture of today's leading edge electronics products. EVG®510 Semi-automated Wafer Bonding System up to 200 mm EVG®501 Wafer Bonding System up to 200 mm EVG®520 IS Semi-automated Wafer Bonding System up to 200 mm EVG®540 Automated Wafer Bonding System up to 300 mm 80 µm SU-8 resist features with sidewall angles approaching 90° Courtesy of DALSA Corporation EVG®540C2W Automated Wafer & Chip-to-Wafer Bonding System up to 300 mm Sub-µm high-aspect ratio...

We act globally. Our lithography, bonding and imprint equipment is designed for reliability, productivity and quality, without any limits. Our highly qualified employees are part of a worldwide network and react quickly and flexibly to customer requests and inquiries. We are always prepared for new challenges. Key Benefits Field Service On-Site Visits Technical Support • Certified engineers are taking care of all equipment related issues • Engineers' long-term experience and technology expertise • ISO certification ensures consistent high quality • Preventive maintenance and repair carried out...

Commitment Without Borders Corporate Headquarters Our highly qualified employees are part of a worldwide network.

Headquarters Worldwide Sales and Customer Support EV Group Europe & Asia/Pacific GmbH DI Erich Thallner Strasse 1 4782 St.Florian am Inn Austria Phone: +43 7712 5311 0 E-Mail: [email protected] Germany EV Group E. Thallner GmbH Hartham 13 94152 Neuhaus Germany Phone: +49 8503 923 852 E-Mail: [email protected] North America EV Group Inc. 7700 South River Parkway Tempe, AZ 85284 Phone: +1 480 305 2400 E-Mail: [email protected] EV Group Inc. 100 Great Oaks Blvd; Suite #119 Albany, NY 12203 E-Mail: [email protected] North America Tech Support...