Introduction
TELICA is ETEL's innovative multi-axes platform designed for semiconductor back-end applications. It features a dual gantry architecture providing motion along X, Y, and Z axes, totaling 8 controlled axes. This system is ideal for advanced die bonding processes, µ-LED bonding, and dispensing applications requiring high throughput and accuracy.

Product Highlights

• Supports wafer (300 mm) and panel (720 x 650 mm) substrates.
• Local placement accuracy of ±350 nm and global placement accuracy of ±1 µm.
• Thermal transient time of less than 10 minutes.
• Throughput of up to 10 kUPH for flip chip die bonding and 180 kUPH for µ-LED bonding.
• Acceleration up to 4 g in X, 6 g in Y, and 7.5 g in Z.
• Speeds up to 2 m/s in X and Y, and 1 m/s in Z.
• ISO 5 cleanroom compatibility.

Innovative Features
TELICA's architecture allows simultaneous optimization of accuracy and throughput. It introduces a secondary metrology loop at the process plane level, reducing Abbé errors and positioning mismatches. The platform integrates ETEL's AccurET controllers, offering features like non-linear control, advanced feedforward, trajectory filters, and full axis synchronization with nanosecond jitter.

Variants

• Variant 1: Dual gantry for Wafer Level Packages with travels of X410 x Y445 x Z30 mm.
• Variant 2: Dual gantry for Panel Level Packages with travels of X750 x Y800 x Z30 mm.

Control and Performance
Multi-dimensional encoders ensure high placement accuracy, while water-cooled ironcore motors support extreme duty cycles. The system's advanced control features include specific gantry control algorithms, multidimensional mapping, and advanced triggering capabilities.