More info Bidirectional repeatability Fine Z with ±30 nm, CZ with ± 7.5 µm and Theta with ±2 arcsec Position accuracy Total axial error of ±3 µm Position stability Fine Z with ±3 nm, CZ with ±50 nm, and Theta with ±25 µarcsec Combined Modules The Z3TM+ module expands the range of motion platforms and integrates four independent degrees of freedom and an optional lift pin mechanism. This module revolutionises motion control in the semiconduc- Utilising flexure-based fine Z-axis technology, hysteresis issues tor industry through its advanced design with four degrees of are avoided while achieving nanometre-level resolution, freedom housed in a single module. With optional coarse Z-axes, accuracy and repeatability with higher dynamics. Embedded this module provides unprecedented control over wafer motion support for sample alignment further enhances process control profiles and improves precision and efficiency in semiconductor and enables users to achieve unrivalled performance at wafer HIGHER CONTROL BANDWIDTH FOR Z TRACKING In inspection systems, moving heavy tools to follow the surface limits speed and throughput. Z3TM+ solves this by moving the lighter substrate instead, increasing bandwidth and enabling faster, more efficient processing. Integration example 6 DOF TOOL POINT CONTROL Many applications need precise XY positioning and perfect orthogonality to the tool, which is hard with traditional stacked systems. Z3TM+ adds Z, Rx, and Ry control to map and compensate stage errors, keeping the point of interest perfectly aligned for processing. VACUUM SUPPLY AT CHUCK LEVEL Z3TM+ comes with 4 fully integrated and independant vacuum lines. These lines are compatible with the 364° theta stroke. WAFER HANDLING MADE EASIER This module also comes with a 3-point electrical lift-pin mechanism to ease wafer loading and offloading. Stroke: ±2 mm, CZ: 12 mm, Rx/Ry: ±0.08° and Theta 364° Move and settle time: Z: 100µm @ 50nm in 60 ms / Theta: 1° @