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Combined Module Z3TM flyer

Combined Module Z3TM flyer

Combined Module Z3TM flyer

Product catalog summary
Introduction
The Z3TM Combined Module is an innovative motion control solution designed to enhance motion platforms, particularly in semiconductor applications. It offers four independent degrees of freedom, including rotary, vertical, and two oblique axes, providing a comprehensive solution for wafer motion profiles.

Product Highlights
  • Infinite Theta rotation
  • Tip and tilt correction over ±0.08°
  • Vacuum feed-through to interface level
  • ISO class 2 clean room compatibility
  • Radial runout of ±3.5 µm
The module addresses the limitations of piezoelectric solutions by eliminating hysteresis and supporting nanometer-level resolution, accuracy, and repeatability.

Main Specifications
  • Total stroke: ±2 mm (Z), ±0.08° (Tip-Tilt), infinite (Theta)
  • Position stability: ±3 nm (Z), ±0.08 arcsec (Theta)
  • Bidirectional repeatability: ±30 nm (Z), ±2 arcsec (Theta)
  • Move and settle time: 60 ms for 100 µm within ±30 nm, 525 ms for 180° within ±40 µ°

Typical Applications
The Z3TM is suitable for industries such as Medical, Instrumentation, Pharmaceutical, and Automation, as well as advanced semiconductor equipment. It simplifies design efforts, reduces equipment complexity, and improves cost-efficiency, enabling faster time-to-market.

Conclusion
The Z3TM module is a result of ETEL's continuous innovation and integration, leveraging proprietary IP and collaboration with HEIDENHAIN for superior positioning accuracy. It can be integrated into the CHARON2 stacked platform, offering enhanced process controls and performance.
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Catalog excerpts

Combined Module Z3TM flyer-1

Combined Module ETEL S.A. Zone Industrielle 2112 Môtiers Switzerland version 1.0 - 02/20 - subject to modifications without previous notice [email protected] • www.etel.ch

 Open the catalog to page 1
Combined Module Z3TM flyer-2

Innovative Motion Control ■■■ Z3TM COMBINED MODULE By design, this optional module enables complete fulfillment of wafer motion profiles for advanced semiconductor applications, thus providing OEMs with a turn-key solution for any semiconductor technology. The product compactness establishes record density in terms of number of functions per volume, while its performance set new market standards for wafer level accuracies and dynamics. Today adopters not only simplify their design efforts for higher precision, moreover materialize dramatic reductions in equipment complexity, reliability, integration...

 Open the catalog to page 2
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