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TDDB Evaluation System

TDDB Evaluation System

TDDB Evaluation System

Product catalog summary
Overview: The document describes the TDDB Evaluation System, specifically the AMM-1000 model, designed for precise data acquisition and reliability evaluation of oxide films in high-density, high-function LSIs. This system is crucial for analyzing failures due to pressure resistivity and characteristics of thin insulation oxide films at various levels, including wafer, glass substrate, and package levels.
System Features:
  • Prober for LCD: Includes systems for evaluating through-hole conductors, solder-joint contacts, connector contact resistance, and more.
  • Measurement Capabilities: Equipped with DC Multi Source Measurement (MSM) on each channel, allowing for voltage and current monitoring and output. The system supports up to 200 MSMs.
  • Precision: Offers precise current and voltage application measurements with a wide range of resolutions.
  • High-Speed Measurement: Capable of measuring at a top speed of 10msec per 40 channels.
  • Output and Compatibility: Data can be outputted in CSV format and is compatible with LAN for system expansion.
System Configuration:
  • MSM Unit: Incorporates 40-channel MSMs per unit, with a maximum of 5 units.
  • Chamber: Evaluates specimens at package level under high temperature using the TEG board.
  • Prober Types: Includes wafer level and liquid crystal glass substrate probers, compatible with various wafer sizes and temperatures.
Evaluation Procedures:
  • Measurement Modes: Includes current stress measurement, fixed voltage measurement, two-step current stress measurement, step voltage measurement, and soft breakdown mode.
  • Data Acquisition: Offers different modes for data acquisition, including short, medium, and long modes, with varying intervals and averaging cycles.
Specifications:
  • Voltage and Current Range: Offers a range of -50V to +50V and -100mA to +100mA with high resolution and accuracy.
  • Temperature Range: Probers and chambers support high temperatures, with specific requirements for utilities and dimensions.
Additional Information: The document includes contact information for ESPEC offices worldwide and notes on the company's ISO 9001:2008 certification.
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Catalog excerpts

TDDB Evaluation System-1

TDDB Evaluation System AMM 1000

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TDDB Evaluation System-2

Precise data acquisition Endless pursuit for reliability The Oxide Film Property Evaluation System As wafer size is enlarged for mass production of high-density, high-function LSIs, reliability evaluation of oxide film is on increasing demand, which is key for LSI reliability. ESPEC'S TDDB Evaluation System will play an indispensable role for analyzing failure caused by pressure resistivity of thin insulation oxide film and characteristics and flattening of oxide film, at wafer, glass substrate, and package level.

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TDDB Evaluation System-3

MEASUREMENT EVALUATION SYSTEMS CONDUCTOR RESISTANCE EVALUATION SYSTEM THROUGH-HOLE CONDUCTOR EVALUATION SYSTEM SOLDER-JOINT CONTACT EVALUATION SYSTEM BGA, CSP SOLDER JOINT CONTACT EVALUATION SYSTEM CONNECTOR CONTACT RESISTANCE EVALUATION SYSTEM FPC LIFE EVALUATION SYSTEM OTHER INTERCONNECTION MATERIAL CONTACT EVALUATION SYSTEM ION MIGRATION EVALUATION SYSTEM INSULATION RESISTANCE EVALUATION SYSTEM CAPACITOR INSULATION RESISTANCE EVALUATION SYSTEM PCB, PWB INSULATION RESISTANCE EVALUATION SYSTEM INSULATION RESISTANCE EVALUATION SYSTEM FOR OTHER INSULATION MATERIAL LOW-K INSULATION CHARACTERISTIC...

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TDDB Evaluation System-4

Performance System configuration to fit number of measurement Equipped with DC Multi Source Measurement (MSM) on each channel, which enable monitoring and output of voltage and current. MSM consists of 4 channels per board. The basic 40-channel configuration stores up to 10 boards. The system can be upgraded according to measurement volume and condition up to 5 units (200 MSMs). Precise current and voltage application measurement Current at 9 ranges, measurement resolution of maximum current 100mA, and minimum current 1pA. Voltage at 2 ranges, resolution of maximum voltage 50V and minimum voltage...

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TDDB Evaluation System-5

SYSTEM BLOCK DIAGRAM System controller power supply 10 boards per unit 4 MSMs per board GP-IB Uninterruptable Uninterruptable power supply Backup power supply for controller (Does not reset automatically when power restored) MSM unit Manual prober Hot chuck controller Printer E-BUS MSM unit Incorporates 40ch MSMs per unit (maximum 5 units) Connection BOX panel Can be set as panel for prober shield BOX. Triaxial cable Connects specimen and MSM to reduce noise level. Chamber Evaluation at package level of specimen, under high temperature, using the TEG board. E-BUS Temperature control, monitor,...

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TDDB Evaluation System-6

SPECIFICATION Model Software Voltage/current application range Resolution Voltage/current measurement range No. of measurement channels Measurement sampling speed Short mode: 0 to 100msec10msec interval 100msec to 10sec 100msec interval Over 10secaccording to time table below Data acquisition without averaging Medium mode: 0 to 100msec20msec interval 100msec to 10sec 100msec interval Over 10secaccording to time table below Averaging per 1 cycle Long mode: 0 to 10sec100msec interval Over 10secaccording to time table below Averaging per 5 cycle Time table Measurement interval 10 sec 100 sec 1 sec...

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TDDB Evaluation System-7

EVALUATION PROCEDURES Execute test by selecting from the following measurement mode library. Fixed Voltage Measurement Mode Step Voltage Measurement Measured with fixed voltage stress. The measurement current and breakdown time are stored. Measures the current at each voltage level while increasing I-V characteristics measurement, TZDB method) Applied voltage Applied voltage voltage application stepwise. Voltage that reached Emax Tox or Jmax dt dVG Soft Breakdown Mode Step Current Measurement (TZDB) Measured by changing stress voltage and measurement voltage. The voltage measurement can be adjusted...

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TDDB Evaluation System-8

ESPEC CORP. Head Office 3-5-6, Tenjinbashi, Kita-ku, Osaka 530-8550, Japan ESPEC NORTH AMERICA, INC. ESPEC EUROPE GmbH ESPEC ENVIRONMENTAL EQUIPMENT (SHANGHAI) CO., LTD. Head Office BEIJING Branch TIANJIN Branch GUANGZHOU Branch SHENZHEN Branch SUZHOU Branch ESPEC TEST TECHNOLOGY (SHANGHAI) CO., LTD. Quality Management System Assessed ESPEC CORP. has been assessed by and registered in the Quality Management System based on the International Standard ISO Japanese Standards Association (JSA). Environmental Management System Assessed and ESPEC CORP NO12B14C02 (The contents of this catalog is as...

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