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Clean Oven for FPD (HSC series)

Clean Oven for FPD (HSC series)

Product catalog summary
Features of the Clean Oven for FPD (HSC Series):
  • The oven supports substrates horizontally using pins on a substrate rack, minimizing thermal image failures.
  • Optional countermeasures against sublimates include a ventilating system that reduces the concentration of chemicals vaporized from glass substrates by circulating heated fresh air.
  • A sucking system at the shutter slit area prevents air leakage and diffusion, while an air-blow system enhances exhaust efficiency.
  • Additional exhaust systems can be installed in the robot module to maintain a cleaner environment in the clean-room.
Specifications:
  • Compatible with glass sizes up to the 8th generation.
  • Temperature range: +100 to +300°C.
  • Temperature distribution: ±4.5°C at a glass surface temperature of +230°C.
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Catalog excerpts

Clean Oven for FPD (HSC series)-1

Clean Oven for FPD (HSC series) Features Supporting a substrate horizontally by pins which are placed on a substrate rack from below reduces “Thermal Image” failures. Countermeasures against Sublimates (Option) To reduce concentration of chemicals vaporized from glass substrates in the oven, a ventilating system takes in fresh air, this air is heated by a heater, and makes the air circulate. A sucking system installed on a shutter slit area sucks a leaking air to prevent diffusion. We installed Air-Blow system on under-side of shutter slit area to make more definitive exhaust. To keep your clean-room more cleanly, ceiling / under floor exhaust system can be installed in robot module. Specifications (Example) Processing glass size Operating range Temperature uniformity Max. 8th generation glass 100 300 4.5 at 230 on the glass surface

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