500°C Clean Oven (SCO series)
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Low Oxygen Clean Oven Realized “Low Oxygen Concentration: Below 10ppm, Cleanness: Class 10, and Maximum Temperature: 500℃!” FPD-related Equipment → http://www.espec.co.jp/english/products/products04.html Low Oxygen Clean Ovenhas realized the specification which the former Clean Ovens never satisfied! ・Oxygen Concentration: Below 10ppm ・Cleanness: Class 10 ・Temperature Property: Maximum500℃ distribution ±5℃ Usage Examples ●Semiconductor wafers and glass substrates for FPD ●Electronic parts for space and aviation ・For the clean and high-temperature process under the low oxygen concentrate. ・For the substitute for the costly vacuum machines Reconsideration of the process Strong Points exhaust Realized the Low Oxygen Concentration: Below 10ppmOP) The hot wave cycling type altered the common cooling type of introducing air outside into water cooler, and creates an airtight chamber. In addition, the shafts of the blower motor use magnetic seal, and other fixing ports use metal seal, so as to raise the airtightness Special heat-resistant filter Rack in the chamber Glass (600×720mm Secure the High Property of Temperature Distribution ±5.0℃at 500℃ More than 0.30μm More than 0.50μm More than 1.0μm 0.30μm以上 0.50μm以上 1.0μm以上 The simple air conditioning system saves the space. It helps to construct the adequate double inner walls and secures the certain air insulation. Setting the water cooler outside of the chamber clears away the unnecessary structure like a dumper. This produces a simple air conditioning system, under which the proper amount of cycling wind secures the temperature distributional property. The oven adopted the materials taken measures for corrosion and thermal expansion. Moreover, this oven’s peculiar construction and the heat-resistant filter realized the cleanness of class 10 (particle 3μm across) during not only the steady temperature period, but also the changing temperature period. It lessens the pile on the specimen during the process. Fig. The 図4　安定500℃運転時のクリーン度 Operation Cleanness under Steady 500℃

Examples of System Combination Other than chamber itself + batch processing with manual cart, this oven can be expanded in the automatic system. An Example: ACCSClustery Conveyor Type The combination of conveyor robots and buffer modules can construct the automatic system as shown to the right. It is also possible to join Glove Box and various N2 conveyor modules. Temperature Range Temperature Distribution Possible Specimen Wafer carrier 8inch, 12inch Glass substrate W370×L470、W600×L720、 W730×L920 Please contact us about other specimen. Oxygen Concentration 貫通電極 焼成 ポリイミド 注入 真空装置 真空オーブン...

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