Ersa HOTFLOW 3 Series Reflow Soldering on the Highest Quality Level at the Lowest Production Cost

Production needs us. Cost savings through Technical Highlights: Best Heat Transfer Highest Throughput Smallest Cross-Sectional ∆T Maximum Machine Availability Best Energy Balance Lowest Energy Consumption Best Oven Stability Excellence Serviceability Ready for Traceability 2

$ € With the lead-free implementation now behind most of us, today’s concerns in the PCB manufacturing industry are moving in a very exciting direction. Market demands are forcing the OEM and EMS global players to look beyond the soldering process alone in order to optimize the manufacturing process from a total economic efficiency standpoint. Maintaining the competitive edge will go to those strategic manufacturers who maximize production output per m² of floor space, who minimize the defect rate and minimize the total cost of production per PCB: better said, who maximize the total profit per...

Multijets The specially designed nozzle system Improved heat transfer with high density multijets Multijet Heating Cassette Technology Best coefficient of heat transfer with smallest ∆T on the market In a reflow oven, the efficiency of the heat transfer has a primary effect on all aspects of quality, productivity and running costs which directly influence profitability. Our heat transfer guarantees a minimum ∆T which translates into maximum profile flexibility. The proven Ersa Multijet heating technology has been re-designed and improved to achieve a completely new level of reflow performance....

Process control Unrivaled Process Control EPC – Reproducible results through a redundant measuring system in the HOTFLOW 3 Reflow-Oven Zone 1 Zone 2 Zone n Zone n+1 Valve Thermocouples Visualization Main-PLC EPC-PLC Working with the correct parameters, a soldering system will deliver optimal soldering results. Yet, it needs to be assured that these results can be produced with sustained repeatability. Therefore, the relevant processes need to be closely monitored. speed, the zone temperatures and the convection in each zone. It is these three parameters which mainly determine the temperature...

Process tunnel Improved Reflow Process Tunnel Process tunnel, tested for tightness, guarantees long-term stability Optimized Reflow Process Tunnel Process Stability under all load conditions The most efficient reflow heating system allows for the most flexibility in the loading conditions. The improved Multijet heating technology requires almost no distance between PCBs regardless of type, size and mass. The HOTFLOW series oven guarantees absolute process stability when running at “Board on Board” maximum capacity. Intermittent and/or continual loading does not affect the longterm process stability...

Advanced Active Cooling Top- & bottom-side cooling available on demand Slow Cool: -2,5 °C/sec Fast Cool: -5 °C/sec “Power Cool” advanced active cooling technology The demands on an efficient cooling system in a reflow oven are higher than often expected. In the first instance, the cooling gradient plays an important role in determining solder joint stability. For lead-free applications, JEDEC recommends a cooling gradient between 2 to 6° C/sec in order to achieve an optimal solder joint microstructure and in order to prevent component damage. Maximum Flexibility by Cooling Cooling gradient can...

Serviceability Maintenance-On-the-Fly Highest machine uptime due to maintenance-friendly machine design Maintenance – “On-the-Fly” The system continues to operate in production while the condensation management system is being cleaned Quick and easy servicing Through excellent accessibility and connections through quick couplings 8 More and more, the ROI (Return of Invest) and TCO (Total Cost of Ownership) analysis are playing an important role in the decision making process for the purchase of manufacturing equipment. While the ROI and TCO aspects must be considered, they do not cover one potentially...

Keeping the oven clean from residues, remains to be a major concern during a reflow process. Ersa’s proven multistage management system has been completely re-designed to offer new DUAL capability. Condensation management with cleaning granulate The HOTFLOW 3 can now be fitted with a substantially improved process gas cleaning unit. Up to now, the process gas was extracted from the tunnel between the reflow and the cooling zone, subsequently cooled down respectively cleaned and fed back to the system in the cooling zone. The condensate, accrued during the cooling process, was collected in the...

Multitrack Multiple track ovens for multiple placer lines. Dual, triple and quad transport machines available Multiple Track Capacity Productivity with highest throughput Highest throughput using multiple track Best machine output/m² of floor space The running demands on a reflow oven and the calculated ROI depend on the expected utilization requirements. Strictly from a profit per PCB standpoint, it is the highest volume “24/7” applications which put the most demands on a reflow system and which push the ROI calculation to the limit. Defining our primary customer target group as having the most...

New extreme low mass center support Precision support even for flex prints Extreme Low Mass PCB Center Support Maintains linear stability The HOTFLOW uses a new technology which offers many advantages – mechanical stability, low mass for reduced shadow effect and minimum space requirement. The extreme low-mass center support (German utility patent granted) offers continuous support especially for very thin PCB substrates and guarantees linear precision over the entire length of the oven. The specially designed supports automatically fold down flat to allow for bottom-side Multijets to remain...

— mif-i.i— iHwiKt- ipu?r wtiui- rn: i in ii— M»JI— -»u — wrHU*iB-iuitMi^ Ersa AutoProfiler with Library Off Line profiling saves time and money A "Virtual PCB" is created and sent through the "Virtual Oven" - first run success Machine Software Process visualization and data The user-friendly machine software platform includes a new Process Con- trol Software, a Process Data Recorder and the Ersa AutoProfiler for rapid of- fline profiling. The design goals be- hind this advanced machine software package include the simplest possible ERSASOFT allows for total process operation of the machine, process...