Ersa HOTFLOW 4 Series
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Reflow soldering with superior performance and the best energy balance

Cost saving through technical highlights ■ increase in productivity through double or triple conveyor ■ Grip conveyor ■ Optimized energy transfer, minimized delta T ■ Zone separation and controlled cooling zone temperature ■ Switchable internal/external cooling aggregate ■ 100 % inspected process tunnel (gas tight) ■ Low energy and N2 consumption ■ Highest machine availability ■ Heating- and cooling modules retractable without the use of tools ■ Low mass center support, return within the system tunnel ■ EPC process control software The Hermes Standard for "M-to-M" in SMT Assembly The...

ersa HOTFLOW'

Energy efficient motors, perfect air guidance and the raised level of overall efficiency ensure the best heat transfer rate during heating level of overall efficiency of the system. The method of heat transfer in Ersa reflow systems guarantees a minimal ∆ T at the lowest power consumptions. In modern reflow systems, the efficiency of the heat transfer exerts an important influence on all matters related to quality, productivity and operational cost, which, together, directly impact on the profitability of the process. It is just for this reason that in the HOTFLOW 4 model line, special...

Process lengths from 3.30 m up to 7.10 m ersa HOTFLOW® 4/8 Process length: Heated zones: Solder/peak zone: Cooling zones: Throughput rate*: GrsaHOTFLOW® 4/14 Process length: Heated zones: Solder/peak zone: Cooling zones: Throughput rate*: area HOTFLOW® Process length: Heated zones: Solder/peak zone: Cooling zones: Throughput rate*: Heated zones: 26 zones Solder / peak zone: 4 zone Cooling zones: 4 zones Throughput rate*: 10.2 sec/pcb

Truly cool: An efficient thermal management is the determining factor for the optimal performance of a reflow soldering systems. Yet, it is not only a sophisticated and precise heating technology that is called for, but of equal importance is a precise and energy efficient cooling process. The cooling gradient is an important process parameter for the quality and structure of the solder joints, but it is equally important for subsequent production processes, for which a defined exit temperature is required to allow an error-free handling of the assembly. The state-of-the-art HOTFLOW 4...

Cooling in matching steps Basic Cooling: Air cooling Cooling Step 1: Internal cold water circulation Cooling Step 2: Internal cold water circulation with external cooling aggregate Kühlaggregat extern

Truly clean: Cleanliness of the process zone is of supreme importance in the reflow process, since it determines the uptime of the system and ensures a stable and reproducible process. Contaminations in the process gas atmosphere stem from various sources. The two most important are the solder pastes and the base material of the printed circuit board. It is the most basic task of the no-clean-management system to remove these contaminants from the process gas atmosphere, so that neither the board assemblies nor the process gas tunnel are soiled by them. To cover and effectively remove as...

Preheat Zone Peak Zone i Cooling Zone i i Aside from low condensing compounds, long-chain molecules which deposit on the hot inner surfaces of the process chamber are present in the process atmosphere, contaminating the tunnel. To effectively remove these types of contaminants, the long-chain molecules must be broken up through their exposure to high temperatures. Thereby, harmless compounds are being formed which will not condense in the process zone. This optionally available cleaning stage is designed such that the hot process gas is extracted right at the upper and the lower peak...

Innovative Ersa Grip conveyor technology for printed circuit boards as well as flex boards in mixed production The trend in reflow soldering technology is clear - users demand equipment providing them with high uptimes, which performs consistently and reliably to a high quality level, and which demonstrate excellent economic efficiency that will allow for an ROI in no time. It is clear, that these demands can only be met by systems offering multi-track operation, which in turn has a direct impact on the design and structure of new SMT production lines. State-of-the-art production...

be placed independently of each other, so that at all times the maximum of support is ensured. In order to achieve the greatest latitude for components mounted on the underside of the assembly, it is also possible to completely move the center support from the working area of the track. It is equally possible to use two or three center supports on a single track. Its mechanical stability, low heat capacity, lack of a shadowing effect, as well as its minimal space requirement are additional advantages of this proven technology. Conveyor systems from single to triple-track operation and up to...

Truly comfortable: ■ System control and monitoring ■ Editing and administering solder programs ■ Trace data acquisition as per ZVEI-standard (included) ■ Solder protocols, process writer ■ Alarm messages management ■ Automatic time control ■ Clearly arranged and intuitive to operate ■ Comfortable touch operation ■ Backward compatibility ■ Linking to Manufacturing Execution System (MES) possible All Ersa reflow systems are operated under PC control with ERSASOFT. This machine visualization software offers numerous functions which assist the system user to operate the system error free. For...

Ersa Sensor Shuttle PTP® Professional temperature measuring system The wireless data transmission uses Bluetooth technology which makes the Ersa Sensor Shuttle PTP® especially easy and convenient to use. The system is equipped with 8 measurement channels that can be connected to commercially available Ni/CrNi thermocouples. Auto. profile evaluation with 6 parameters; Display of the continuous gradients; and up to 17 profiles The Ersa Sensor Shuttle PTP® is an ideal and flexible instrument for evaluating and monitoring processes. When it comes to measuring temperature, speed and evaluating...