Reflow soldering on the highest quality level at the lowest operating cos

Cost savings through technical highlights: Best heat transfer Highest throughput Smallest cross-sectional AT over the entire process width Maximum machine availability Best energy balance Lowest energy consumption Best oven stability Excellence serviceability Ready for Traceability Soldering systems with innovative reflow technology for maximum quality at lowest operating costs Global shifts in labor costs, rising energy costs and exchange rate risks are increasingly weighing on profitability. Maintaining the competitive edge will go to those strategic manufacturers who maximize production output...

A suitable system for each application

Multijets The specially designed Ersa nozzle system - improved heat transfer with high density multijets Multijet Heating Cassette Technology Best coefficient of heat transfer with smallest ∆T on the market In a reflow oven, the efficiency of the heat transfer has a primary effect on all aspects of quality, productivity and running costs which directly influence profitability. Our heat transfer guarantees a minimum ∆T which translates into maximum profile flexibility. The proven Ersa Multijet heating technology has been re-designed and improved to achieve a completely new level of reflow performance....

Process control Unrivaled Process Control EPC - reproducible results through a redundant measuring system inthe HOTFLOW 3 1 i * _xL . Working with the correct parameters, a soldering system will deliver optimal soldering results. Yet, it needs to be assured that these results can be produced with sustained repeatability. Therefore, the relevant processes need to be closely monitored. This can be achieved in either of two ways: The first would be to intermittently record profiles of individual boards, and compare these for consistency with previously recorded profiles, while the second method...

Process tunnel Improved reflow process tunnel process tunnel, tested for tightness, guarantees long-term stability Optimized Reflow Process Tunnel Process stability under all load conditions The highly efficient reflow heating system allows for a maximum reproducibility for any loading conditions. Regardless of type, size and mass, the improved Multijet heating technology requires almost no distance between PCBs. The ovens of the HOTFLOW series guarantee absolute process stability even when running at “Board on Board” maximum capacity. Furthermore, intermittent and/or continual loading does not...

Power cooling – PCB exits “Cool to Touch”! Advanced active cooling - top- & bottom-side cooling available on demand Slow Cool: -2,5 °C/sec Fast Cool: -5 °C/sec Maximum flexibility by cooling - cooling gradient can be set at fast or slow “Power Cool” advanced active cooling technology The demands on an efficient cooling system in a reflow oven are higher than ever. First and foremost, the cooling gradient plays an important role in the homogeneity of soldered joints. For lead-free applications, JEDEC recommends a cooling gradient between 2 to 6 °C/sec in order to achieve an optimal solder joint...

Highest machine uptime due to maintenance-friendly machine design Maintenance and service friendliness and the required time play a very important role in the consideration of the performance of a modern reflow system. Ultimately, maintenance means usually nothing else as machine downtime and thus production downtime. Maintenance “On the Fly” - the system continues to operate in production while the condensation management system is being cleaned Quick and easy servicing Through excellent accessibility and connections through quick couplings With the “Maintenance-On-the-Fly” option, the condensate...

Efficient process gas cleaning system Keeping the oven clean from residues, remains to be a major concern during a reflow process. Ersa’s proven multistage management system has been completely re-designed to offer new DUAL capability. Condensation management with cleaning granulate The HOTFLOW 3 can now be fitted with a substantially improved process gas cleaning unit. Up to now, the process gas was extracted from the tunnel between the reflow and the cooling zone, subsequently cooled down respectively cleaned and fed back to the system in the cooling zone. The condensate, accrued during the...

Multitrack Multitrack ovens for multiple placer lines. Dual, triple and quad transport machines available. Multiple Track Capacity Productivity with highest throughput Highest throughput using multiple track Best machine output/m² of floor space The running demands on a reflow oven and the calculated ROI depend on the expected utilization requirements. Strictly from a profit per PCB standpoint, it is the highest volume “24/7” applications which put the highest demands on a reflow system and which push the ROI calculation to the limit. Defining our primary customer target group as having the most...

Extremely low-mass center support Precise, reliable and energy-saving The extremely low-mass center support (German utility patent granted) offers continuous support especially for very thin PCB substrates and guarantees linear precision over the entire length of the oven. The specially designed supports automatically fold down flat to allow for bottom-side Multijets to remain as close as possible to PCB. Mechanical stability, no heat absorption or shadow effects as well as minimal space requirement are the essential advantages. Conveyor systems from single to quad track operation and up to four...

The AutoProfiler with library Off-line profiling saves time and money: A “virtual PCB” is created and sent through the “virtual oven” – first run success >90% Machine Software Process visualization and data management The user-friendly machine software platform includes a new Process Control Software, a Process Data Recorder and the Ersa AutoProfiler for rapid offline profiling. The design goals behind this advanced machine software package include the simplest possible operation of the machine, process monitoring and visualization, reduction in the time required for configuring parameters and...