GLOBAL. AHEAD. SUSTAINABLE. Ersa ERSASCOPE M & Ersa ERSASCOPE M plus Optical inspection systems for hidden solder joints. The ERSASCOPE M and M plus are multi-purpose inspection video microscopes to analyze hidden solder joints in electronic production environments including measurements of solder joints on Ball Grid Array (BGA) and many other SMT packages. Their application field covers the visual inspection of components on printed circuit boards in Surface Mount Technology (SMT) or Through-Hole Technology (THT) in general, but also the visual inspection of PCB lands or solder paste prints. The devices can be used in quality assurance, production, laboratories, or R&D departments. The compact ERSASCOPE M units connect with a PC or laptop via a USB interface, and within minutes they are ready for operation. Thanks to high-quality BGA optical heads, the inspection of components with hidden solder joints is easy. A MACROZOOM lens allows top-view surface inspection in various magnifications. All optical heads are plugged onto the high-resolution digital color camera hand piece which makes changing the optical heads in accordance to the inspection task a matter of seconds. Long-life dimmable LED lights are integrated in the optical heads and provide optimal illumination of the solder joints. The ERSASCOPE M is equipped with an additional LED brush light for BGA inspection. It is essential for backlight illumination or to light up very hidden and hard to reach areas. The ERSASCOPE M plus includes a powerful external LED light source plus gooseneck light fibres as well as a light brush for optimized illumination conditions. Both systems come with the ImageDoc inspection software. This proven and well-established software not only displays the live images, but also offers the operator various possibilities for documentation and analysis of the inspection results. Technische Highlights: igh-resolution 5 MP USB H camera Interchangeable high-quality lenses ultifunctional tripod and M X-Y table with rotation for difficult inspections ompletely ESD safe C ncluding ImageDoc Basic I s

GLOBAL. AHEAD. SUSTAINABLE. Technical Data: Order No. Technical Data Stand with Z-axis micrometer adjustment; integrated fibre optics and camera cables W x H x D: ~ 500 x 400 x 520 mm Total weight ~ 5 kg Antistatic surface, includes 1,000 mm coated fibre optic cable with gooseneck Basic camera unit, digital 1/3” N-MOS solid state color image sensor 2,592 (H) x 1,944 (V) pixels (5.0 MP), USB 2.0 interface L x W x H: 114 x 36 x 51 mm (without cable) BGA lens, 90° optical head for BGA inspection, pitch 1.27 mm Magnification: 5x up to 280x Focusing range: 0.5 mm up to 100 mm Field of view (FoV):...