
MicroSpeed 1.0 mm High Speed Connectors ED. 02 | 05.2015 Full-Scale MicroSpeed 50 Pins
Open the catalog to page 1MicroSpeed - High-Speed Connectors HIGH-SPEED. INTERCONNECT. SOLUTIONS. MicroSpeed the most versatile interconnect solution ERNI’s MicroSpeed® connector family is synonymous with fast data transmission, for high signal quality and for time proven reliability in permanent application. The shielded connector family with 1 mm pitch enables high-speed data applications with up to 25 Gbit/s. The connectors are ideal for next generation communication standards like Ethernet 100 Gbps (IEEE 802.3ba), Optical Internetworking Forum (OIF), USB 3.1 etc. Typical applications which will benefit from the new...
Open the catalog to page 2MicroSpeed - High-Speed Connectors CONCEPT —| FEATURES Pitch No. of Pins Data rate Board-to-Board height Termination technology Connectors 1.0 mm 50 (2-row), 75 (3-row), 91 and 133 (7-row) up to 25 Gbit/s 5 - 20 mm SMT (signal contacts), SMT or THR (shield contacts) 2-row versions 3-row versions (MicroSpeed Triple) 7-row versions (Open Pin Field Array) Power Modules Male and female connectors Vertical and right angle Standard (non-Blind Mate) and Blind Mate EMC enhanced shielding MicroFlex FPC Customized solutions
Open the catalog to page 32-row Stacked boards (Mezzanine) 2-row Extender card (Coplanar)
Open the catalog to page 43-row Stacked boards (Mezzanine) 7-row Stacked boards (Mezzanine)
Open the catalog to page 5BLIND MATE DESIGN For various requirements the MicroSpeed family of products offer the best solutions: Robustness / Size of Connector • Standard (very small-sized footprint) • Blind-Mate (very robust, slightly larger footprint) Electromagnetic Compatibility (EMC) • Standard shields (very good EMC performance) • EMC improved shields (outstanding EMC capability; minimized coupling inductance) • Blind Mate versions feature - a distinctive polarization of the mating face - extended guides to capture the mating connector - increased wall thickness - slightly larger footprint • Self-aligning feature,...
Open the catalog to page 6| HIGH-END EMC SHIELDING Standard Shielding • EMC fingers on Female EMC Enhanced Shielding • EMC fingers on Male • Additional SMT shielding tabs for both Male and Female Significantly reduced coupling inductance and hence excellent electromagnetic compatibility. • MicroSpeed’s high-end shielding design guarantees best performance and highly effective electromagnetic compatibility - standard shielding provides an excellent interference resistance / immunity against electrostatic discharge (ESD) - minimizes the emitted electromagnetic interference (EMI) and prevents undesirable influences on sensitive...
Open the catalog to page 7| INTERFACE/MATING FACE • Superior reliability due to dual-beam female contact design: - Twisted contact tulip (90°) - Homogeneous, rolled surface guarantees secure contact - Wide contact surface between mated pair - Low surface roughness minimizes abrasion - Low contact resistance • Provides excellent misalignment tolerance/ tole rance compensation • Wipe length 1.5 mm • Durability: > 500 mating cycles • Contact finish: Au plating • Lubricated contacts avoid fretting corrosion • Shrouded housing protect contacts; high-temperature resistant materials • Distinctive polarization avoids mismating...
Open the catalog to page 8MicroSpeed - High-Speed Connectors ADVANTAGES SMT/SMT AND SMT/THR TERMINATION • Surface mount connectors (SMT contacts / SMT shielding) -- Double sided board assembly -- 100% coplanarity of ≤0.1 mm leads to excellent soldering results • Optional THR terminals on shielding (SMT contacts / THR shielding) -- THR shield terminals provide strong mechanical solder joint for demanding industrial applications BACKSIDE REFLOW SOLDERING MicroSpeed meets highly efficient board processing: • Capable of backside reflow soldering vertical low profile male & female SMT versions)
Open the catalog to page 9PICK & PLACE PAD FPC high-speed connections using multi-layer rigid-flexible boards, e.g. • Two-layer FPC • High-speed data 25 Gbit/s • 20 differential pairs • 500 mm length • MicroSpeed Open Pin Field Array, 133 pin • Test equipment for 100 Gig optical network transmission system Pick and place pad for vacuum pick-up nozzles provided for straight connectors High-temperature plastic to withstand reflow solder temperatures Right angled versions are commonly picked-up at the smooth shield surface
Open the catalog to page 10POWER MODULES Power Modules supplement the MicroSpeed product portfolio and enable the board’s power supply. • Miniaturized design with high power blade contacts of 2 mm pitch • High current carrying capacity of 18 A per contact • Durable and very reliable 3-point dual-beam female contact • THR shield terminals provide strong mechanical resistance particularly suitable for industrial applications subject to mechanical stress Various types of Power Modules allow for virtually every PCB arrangement: mezzanine, backpla-ne-to-daughtercard or extender card applications. • Male and female Power Modules...
Open the catalog to page 11MicroSpeed - High-Speed Connectors HIGH FREQUENCY CHARACTERISTICS Next-generation platforms demand optimal signal integrity performance when routing high-speed signals. Maintaining proper impedance while minimizing discontinuities can be a challenge. Also unwanted noise from coupling of nearby signal lines may result in distortion of the desired signal. • The MicroSpeed family of products combines best high-speed performance with excellent signal integrity. Based on experience, the best performance is gives at shorter stack heights as it results in shorter period of time for reflections and undesired...
Open the catalog to page 12MicroSpeed connectors and Open Pin Field Arrays offer maximum grounding and routing flexibility for transversal, longitudinal or meshed pin assignments. • Various signal-to-ground pattern meet the individual crosstalk requirements (NEXT, FEXT) and hence maintain signal integrity. • The MicroSpeed Triple supports crosstalk reduction of up to 90% for certain pattern. Impedance matched connectors designed to minimize impedance mismatch For single-ended (50 Q) or differential pair (100 Q) signaling type
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