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MicroSpeed Product Catalog

MicroSpeed Product Catalog
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MicroSpeed Product Catalog

Product catalog summary
General Overview
MicroSpeed connectors by ERNI are engineered for high-speed data transmission up to 25 Gbit/s, suitable for telecommunications, computing, medical technology, and industrial automation. They feature a 1 mm pitch and are compatible with next-gen communication standards like Ethernet 100 Gbps and USB 3.1, offering enhanced electromagnetic compatibility.
Features
Available in 2-row, 3-row, and 7-row configurations, with board-to-board heights from 5 to 20 mm. They support SMT and THR termination technologies, offering standard and blind-mate options with enhanced EMC shielding.
Mechanical Design & Shielding
Robust design with polarized mating faces and blind-mate capabilities. The shielding includes standard and EMC-enhanced options, reducing coupling inductance for superior electromagnetic compatibility.
Contact Design and Durability
Features a dual-beam female contact design with a wipe length of 1.5 mm, exceeding 500 mating cycles. Gold-plated contacts minimize resistance and prevent corrosion.
Termination and Processing
Supports SMT and THR termination, with backside reflow soldering capabilities. Packaged for transport safety and automatic assembly.
Power Modules
Complementary power modules offer high current capacity (18 A per contact) and flexible PCB arrangements, available in standard and blind-mate versions.
High-Frequency Characteristics
Rated for high-speed performance with a 0.5 dB insertion loss at 12.5 GHz, supporting up to 25 Gbit/s data rates, maintaining signal integrity with controlled impedance and reduced crosstalk.
Applications
Suitable for telecommunications, industrial, computing, medical, and intelligent network applications, contributing to sustainable future technologies.
Technical Data
Specifications include a temperature range of -55 to 125°C, current rating of 1 A per signal contact and 10 A per shield, and compliance with IEC standards for dielectric strength and vibration resistance.
Product Specifications
  • Vertical and right-angle configurations in 2-row and 7-row designs.
  • Data rates up to 25 Gbit/s.
  • Standard and EMC enhanced shielding options.
  • Shield contacts in SMT or THR.
  • Heights from 1 mm to 10 mm.
  • Polarized mating face for secure connections.
  • Packaging in tape and reel format.
Dimensional Drawings
Recommended layouts and stacking heights ensure compatibility and optimal performance.
Ordering Information
Each variant is identified by a unique part number, detailing pins, stacking height, termination type, and packaging method.
Key Product Variants
  • Blind Mate, Vertical Female: Standard and EMC enhanced versions, heights of 4 mm to 10 mm.
  • Standard EMC Enhanced, Right Angle Male: Enhanced shielding, available in SMT or THR.
  • Blind Mate EMC Enhanced, Vertical Male: 3-row design with EMC shielding, 1 mm height.
  • Open Pin Field Array: Standard and blind mate designs, 7-row configurations, heights up to 8 mm.
Part Number Index
A comprehensive index of part numbers facilitates easy reference and ordering.
See more

Catalog excerpts

MicroSpeed Product Catalog-1

MicroSpeed 1.0 mm High Speed Connectors ED. 02 | 05.2015 Full-Scale MicroSpeed 50 Pins

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MicroSpeed Product Catalog-2

MicroSpeed - High-Speed Connectors HIGH-SPEED. INTERCONNECT. SOLUTIONS. MicroSpeed the most versatile interconnect solution ERNI’s MicroSpeed® connector family is synonymous with fast data transmission, for high signal quality and for time proven reliability in permanent application. The shielded connector family with 1 mm pitch enables high-speed data applications with up to 25 Gbit/s. The connectors are ideal for next generation communication standards like Ethernet 100 Gbps (IEEE 802.3ba), Optical Internetworking Forum (OIF), USB 3.1 etc. Typical applications which will benefit from the new...

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MicroSpeed Product Catalog-3

MicroSpeed - High-Speed Connectors CONCEPT —| FEATURES Pitch No. of Pins Data rate Board-to-Board height Termination technology Connectors 1.0 mm 50 (2-row), 75 (3-row), 91 and 133 (7-row) up to 25 Gbit/s 5 - 20 mm SMT (signal contacts), SMT or THR (shield contacts) 2-row versions 3-row versions (MicroSpeed Triple) 7-row versions (Open Pin Field Array) Power Modules Male and female connectors Vertical and right angle Standard (non-Blind Mate) and Blind Mate EMC enhanced shielding MicroFlex FPC Customized solutions

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MicroSpeed Product Catalog-4

2-row Stacked boards (Mezzanine) 2-row Extender card (Coplanar)

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MicroSpeed Product Catalog-5

3-row Stacked boards (Mezzanine) 7-row Stacked boards (Mezzanine)

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MicroSpeed Product Catalog-6

BLIND MATE DESIGN For various requirements the MicroSpeed family of products offer the best solutions: Robustness / Size of Connector • Standard (very small-sized footprint) • Blind-Mate (very robust, slightly larger footprint) Electromagnetic Compatibility (EMC) • Standard shields (very good EMC performance) • EMC improved shields (outstanding EMC capability; minimized coupling inductance) • Blind Mate versions feature - a distinctive polarization of the mating face - extended guides to capture the mating connector - increased wall thickness - slightly larger footprint • Self-aligning feature,...

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MicroSpeed Product Catalog-7

| HIGH-END EMC SHIELDING Standard Shielding • EMC fingers on Female EMC Enhanced Shielding • EMC fingers on Male • Additional SMT shielding tabs for both Male and Female Significantly reduced coupling inductance and hence excellent electromagnetic compatibility. • MicroSpeed’s high-end shielding design guarantees best performance and highly effective electromagnetic compatibility - standard shielding provides an excellent interference resistance / immunity against electrostatic discharge (ESD) - minimizes the emitted electromagnetic interference (EMI) and prevents undesirable influences on sensitive...

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MicroSpeed Product Catalog-8

| INTERFACE/MATING FACE • Superior reliability due to dual-beam female contact design: - Twisted contact tulip (90°) - Homogeneous, rolled surface guarantees secure contact - Wide contact surface between mated pair - Low surface roughness minimizes abrasion - Low contact resistance • Provides excellent misalignment tolerance/ tole rance compensation • Wipe length 1.5 mm • Durability: > 500 mating cycles • Contact finish: Au plating • Lubricated contacts avoid fretting corrosion • Shrouded housing protect contacts; high-temperature resistant materials • Distinctive polarization avoids mismating...

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MicroSpeed Product Catalog-9

MicroSpeed - High-Speed Connectors ADVANTAGES SMT/SMT AND SMT/THR TERMINATION • Surface mount connectors (SMT contacts / SMT shielding) -- Double sided board assembly -- 100% coplanarity of ≤0.1 mm leads to excellent soldering results • Optional THR terminals on shielding (SMT contacts / THR shielding) -- THR shield terminals provide strong mechanical solder joint for demanding industrial applications BACKSIDE REFLOW SOLDERING MicroSpeed meets highly efficient board processing: • Capable of backside reflow soldering vertical low profile male & female SMT versions)

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MicroSpeed Product Catalog-10

PICK & PLACE PAD FPC high-speed connections using multi-layer rigid-flexible boards, e.g. • Two-layer FPC • High-speed data 25 Gbit/s • 20 differential pairs • 500 mm length • MicroSpeed Open Pin Field Array, 133 pin • Test equipment for 100 Gig optical network transmission system Pick and place pad for vacuum pick-up nozzles provided for straight connectors High-temperature plastic to withstand reflow solder temperatures Right angled versions are commonly picked-up at the smooth shield surface

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MicroSpeed Product Catalog-11

POWER MODULES Power Modules supplement the MicroSpeed product portfolio and enable the board’s power supply. • Miniaturized design with high power blade contacts of 2 mm pitch • High current carrying capacity of 18 A per contact • Durable and very reliable 3-point dual-beam female contact • THR shield terminals provide strong mechanical resistance particularly suitable for industrial applications subject to mechanical stress Various types of Power Modules allow for virtually every PCB arrangement: mezzanine, backpla-ne-to-daughtercard or extender card applications. • Male and female Power Modules...

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MicroSpeed Product Catalog-12

MicroSpeed - High-Speed Connectors HIGH FREQUENCY CHARACTERISTICS Next-generation platforms demand optimal signal integrity performance when routing high-speed signals. Maintaining proper impedance while minimizing discontinuities can be a challenge. Also unwanted noise from coupling of nearby signal lines may result in distortion of the desired signal. • The MicroSpeed family of products combines best high-speed performance with excellent signal integrity. Based on experience, the best performance is gives at shorter stack heights as it results in shorter period of time for reflections and undesired...

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MicroSpeed Product Catalog-13

MicroSpeed connectors and Open Pin Field Arrays offer maximum grounding and routing flexibility for transversal, longitudinal or meshed pin assignments. • Various signal-to-ground pattern meet the individual crosstalk requirements (NEXT, FEXT) and hence maintain signal integrity. • The MicroSpeed Triple supports crosstalk reduction of up to 90% for certain pattern. Impedance matched connectors designed to minimize impedance mismatch For single-ended (50 Q) or differential pair (100 Q) signaling type

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