Processor - bCOM6-L1400 - 2 Pages

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Processor - bCOM6-L1400

Catalog excerpts

GE Intelligent Platforms bCOM6-L1200 Rugged COM Express Module GE Intelligent Platforms’ bCOM6-L1200 is a rugged, Type 6 COM Express module designed for harsh environments, offering ultimate durability and varying levels of performance-per-watt. Our rugged processing solutions deliver best-in-class performance, provide low total cost of ownership, offer flexible options, and are backed by GE’s commitment to customer satisfaction. GE COM Express modules are perfect for OEMs designing computing platforms into equipment for industrial or harsh environments, and when reducing the overall design cycle and lowering validation costs are of key importance. Best-in-class performance and reliability Longer lifecycles and lower product costs As the leader in rugged COM Express technology, GE understands that processors deployed in harsh environments need to deliver the utmost performance at the level of performance-per-watt selected, at all times, under any condition. Our bCOM6L1200 COM Express module is engineered specifically to meet that need. COM Express architecture separates the processor and carrier card. This extends the useful life of the subsystem by allowing a simple, cost-effective upgrade of the processor alone. The long-term cost of ownership is reduced while ensuring that performance keeps pace with changing needs. Onboard components are specifically selected for their reliability in demanding conditions. Unlike solutions designed for benign environments, our processor and memory are soldered to the board for maximum resistance to shock and vibration. Extended mechanical construction protects the module, which is designed for optional conformal coating for even greater resistance to moisture, dust, chemicals, and temperature extremes. Today’s organizations are operating lean, engineering resources are scarce, and time-to-market is critical. Therefore, GE complements the performance and practical benefits of our COM Express modules with world-class domain expertise and a focus on exceptional customer service. To help you get to market faster and lower your development costs, we can assist you with in-house carrier design work, or build a custom carrier specifically for you. Commitment to customer satisfaction Both GE and its customers trust rugged COM Express to meet the exacting specifications of critical infrastructure applications. FEATURE BENEFIT Rugged design with soldered components • Reliable computing capabilities for applications needing higher immunity to shock and vibration VIA Nano™ or VIA Eden™ processors in varying levels of performance-per-watt • Deliver high performance coupled with low power consumption • Configure the module for the level of performance-per-watt your application requires Dynamic thermal management • Enables controlled system shutdown to avoid damage to equipment • Offers cost saving by allowing simulation in the lab before conducting field tests Flexible options • Additional shock and vibration protection, • Extended operating temperature range for environments with temperature extremes • Conformal coating for protection against dust, moisture and chemicals

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bCOM6-L1200 – Rugged COM Express Module Specifications Block Diagram Rank 1 Rank 2 Chipset Via VX900 HDA USB VGA LVDS PCle SPI SATA Serial PCI SPD Temp Sensor Clock DP2/PCle PCle x4 DVI DP/PCle Solder Option DP1 DP/TMDS MUX DDI1 (DP or TMDS8) PCle x41x8 PCle x4 DDI2 (DP or DVI) PCle x3 DDI3 (DVI or none) VGA LVD8 A HDA Audio 1 x GB Ethernet 2x Serial SPI SMBus MOdule EEPROM LPC, SERIRQ 2x SATA EEPROM 12C GBIO/SD_Card 8xUSB (optional 1 USB Device) VT6 122 GB Eth SPI UEFI DVP VT1632 DVI Transmitter 12C GBIO Control, Reset, WDT Solder Option FSB up to 800MHz Size 1 Gbyte to 8Gbyte LPC 12C FPGA...

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