bCOM6-L1800 - 2 Pages

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bCOM6-L1800

Catalog excerpts

bCOM6-L1800Rugged COM Express® Module Type 6 GE understands that long design cycles and high validation costs make it difficult for OEMs to keep up with the latest processor technologies. We also know that processors deployed in harsh environments need to deliver the utmost performance at all times, under any condition. GE's bCOM6-L1800 module addresses the needs of many high performance applications, taking advantage of the capable video processing, turbo-boost acceleration and power management capabilities of Intel® core™ processors. As such, the bCOM6-L1800 is ideally suited for a wide variety of commercial, industrial, transportation and defense applications in a broad range of embedded computing environments. This durable COM Express solution reduces overall design cycle and validation costs to lower total cost of ownership. Best-in-class performance and reliability The bCOM6-L1800 is the premium solution in GE's COM Express portfolio. It offers the high-level performance and ultimate durability needed for applications that operate in harsh environments. The bCOM6-L1800 should be selected for applications with multiple graphic functions or high-end computing needs. All GE Type 6 modules fully enable the capabilities of the newest generation of processors. Onboard components are specifically selected for their reliability in demanding conditions. Unlike solutions designed for benign environments, the processor and memory are soldered to the board for maximum resistance to shock and vibration. Extended mechanical construction protects the module, which is designed for optional conformal coating for even greater resistance to moisture, dust, chemicals, and temperature extremes. Longer lifecycles and lower product costs The COM Express architecture separates the processor module and carrier card, allowing the useful life of a subsystem to be extended by offering a simple, cost-effective upgrade of the processor alone. Alternatively, once a system is qualified, GE's extended life COM Express modules can be utilized in fixed configuration, long term production programs, under the protection of a Long Term Support contract. Whichever strategy is chosen, GE's range of COM Express modules can help minimize the total cost of ownership and support long term programs typical in the industrial, defense and aerospace markets.

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Memory • Supports up to 32 GB of DDR4 @ 2133 MHz • Soldered, with ECC depending on CPU Block Diagram 6th Generation Intel® Core™ Processor, Intel® XEON® Processor E3 v5 Memory down, 1/2 Ranks DDR4 4/8/16 GBytes 2133MT/s Mobile Intel® CM236, QM170 Chipset HSIO 1-4 8x PCIe Gen 3 HSIO 7-14 8x USB 2.0 USB 0-7 4x SATA HSIO 19-22 HDA HSIO 18 UEFI Flash Others • Alarm sensors for temperature • Environmental Controller on module • Trusted Platform Module TPM 1.2 • Pre-mounted heat sink/spreader for optimal cooling Extension • PCIe® Graphics (PEG) x16 (or 8+8 or 8+4+4) Gen 3, SETUP selectable • PCIe...

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