Electronics Assembly UV Light-Curable Adhesives, Coatings, and Encapsulants for Electronic Assembly

CONFORMAL COATINGS Reliable Board Protection in Seconds Product Number* Nominal Durometer Viscosity Hardness (cP) Description Modulus of Elasticity MPa [psi] Dielectric Strength (Volts/mil) Approvals Secondary moisture cure for 125 D75 150 [21,800] >1,500 MIL-I-46058C listed IPC-CC-830B approved UL recognized 150 D80 410 [60,000] 1,800 MIL-I-46058 listed IPC-CC-830 approved UL recognized 150 D85 900 [130,000] >1,500 MIL-I-46058 listed IPC-CC-830 approved 13,500 D60 19 [2,700] 500 - 2,300 D60 89 [13,000] >1,500 MIL-I-46058C listed IPC-CC-830 approved UL recognized 850 D70 379 [55,000] >1,500 MIL-I-46058C...

THERMAL INTERFACE ADHESIVES Efficient Thermal Transfer Between Heat Sinks and Electronics Product Number 9-20801 Thermal Conductivity Applications Light cure in seconds Secondary activator or heat cure for shadowed Nominal Viscosity (cP) 0.9 W/m*K Description HalogenFree? 110,000 Mounting heat sinks on areas* PCBs LED heat dissipation Highly thixotropic for optimal placement *Dymax 501-E is the recommended activator for shadowed areas Sets in seconds with light exposure Cure shadow areas with activator or heat High-strength bonds Low stress for mismatched CTE’s Room-temperature storage and cure...

RUGGEDIZATION Photocurable Technology Offers Lower Costs and Increased Productivity Product Number Nominal Viscosity (cP) Durometer Hardness Tensile @ Break MPa [psi] Cure Depth mm [in] 38,000 Description and Applications D50 16 [2,300] 6.5 [0.26] Halogen Free? Highly thixotropic for optimal placement and wetting of components 9422-SC See-Cure version for easy visual confirmation of full cure Fast dispense and cure Pre- or post-reflow, room-temperature Simple visual inspection Improved bond strength for die and pry application testing Reduce stress on interconnects during Engineered bead shape...

REMOVABLE MASKS Product Number Description and Applications 9-20479-B 9-318-F Peelable Fluoresces for easy inspection Very fast curing Peelable Wave-solder resistant Blue Excellent viscosity for machine dispensing Cure Depth (mm [in]) Durometer Hardness Cure Speed* (sec) Viscosity (cP) 6.4 [0.25] A70 10 150,000 6.4 [0.25] A55 <4 HalogenFree? 50,000 *Cure speed depends on the intensity and distance from the light source. Cure speed was measured at an intensity of 175 mW/cm2. 100% solids UV/visible cure in seconds No ionic contamination Fluorescing Mask Removable Mask Fluorescing and blue grades...

Flood Chambers and Conveyor Curing Systems for Electronic and Photonic Applications Successful UV processing demands that the curing equipment be matched to the resin to optimize both performance and cost savings. Dymax manufactures UV resins and UV curing equipment and specializes in the optimization of UV curing processes. Our technical specialists are ready to help you optimize your process, and maximize your profit and product performance. For resin and equipment selection assistance please contact Dymax Application Engineering. Dymax 5000-PC Flood Lamp Systems Most Popular and Versatile...

UV Light-Curing Spot Lamps for Electronic and Photonic Applications ® Dymax BlueWave 200 UV Curing Spot Lamp Ideal for fastest processing of small curing areas ® Dymax BlueWave LED Prime UVA Visible Spot Light Curing System Ideal for cool spot curing coatings Liquid Lightguides Come in an assortment of sizes and split wand configurations UV Light-Curable Adhesives, Coatings, and Encapsulants for Electronic Assembly ™ ACCU-CAL 50 Radiometer Ideal for process monitoring Page 7

Reduced environmental impact and energy conservation are core pillars of the Dymax mission. Over the last 30 years, Dymax light-curable materials and curing equipment have become the industry standard for fast, environmentally conscious assembly. Dymax products are readily replacing technologies that contain hazardous ingredients, produce waste, or require higher amounts of energy to process. Dymax understands that safe ecologically friendly products benefit our customers, the environment, and us. We have created materials with attributes that lower product costs, life-cycle costs, and ecological...