The diamond band saw BS200 S is an economically efficient laboratory machine with a fixed sawing unit Passage (length, width) 200×200 mm, cutting length (X-axis) 200 mm. Floor space 800 x 714 mm, 1858 mm hight. The diamond band saw BS200 S has a sliding table that can be manually moved while sawing. During operation the sliding table can also be moved by its own weight. In terms of sawing different thicknesses, the machine can be easily adjusted. Slice thickness can be verified by using the manual lock. The diamond band saw can be operated with a dry cut or alternatively with cooling. Under specific conditions a cooling creates more effective cuttings combined with higher rotational speeds and higher feed rates. The diamond band saw BS200 S cuts various substrates Graphite Precise, even cuts Catalyser Torn bridges don’t break out Tiles The glaze does not flake off Cooling: dry Speed: 35 mm/min Cooling: water Speed: 60 mm/min Cooling: dry Speed: 900 mm/min Cooling: water Speed: 100 mm/min Aluminium oxide Clean cut, no breaking out Stainless steel coole No soldered plates tear off Plastinate Cutting surfaces on parallel planes Cooling: dry Speed: 300 mm/min Cooling: water Speed: 70 mm/min Cooling: water Speed: 2 mm/min Cooling: water Speed: 30 mm/min

Key features Cut width of 0.4 to 0.8 mm (depending on saw band used) means minimal waste. Low processing energy means minimal heating and low tension force is sufficient to clamp the workpiece. This virtually eliminates the risk of chipping when machining fragile or temperaturesensitive parts. The high band speed means high cutting performance. The quality of the cut surface is as if ground. The BS200 S is composed of a band unit with two deflection rollers D = 230 mm with a passage (H x W) of 200 x 200 mm. The diamond saw band runs over two rollers in an endless loop. It is driven and pneumatically...