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T-4909-AE

Product catalog summary

Overview: The T-4909-AE is a manual die bonder designed for budget-sensitive applications, featuring superior ergonomic design and True Vertical Technology™ for maintaining parallelism between chip and substrate. It is equipped with an integrated Raspberry PC with a touchscreen for intuitive programming of bonding parameters and sequences.

Applications: The T-4909-AE supports various application packages including Epoxy, Eutectic, and Flip-Chip bonding, making it suitable for small to medium volume production in areas such as Die Attach, Flip-Chip, MEMS, MOEMS, VCSEL, RFID, and Adhesive Bonding.

Technical Specifications:

XY-Movement: 180mm x 180mm (manual)
Z-Movement: 95mm (manual)
Spindle Rotation: 360° (unlimited)
Bond Force: 20g - 1000g
Placement Accuracy: ±10µm (operator/process dependent)
Flip-Chip Placement Accuracy: ±5µm (optional, operator/process dependent)
Connections: Compressed air 5 - 6 bar / Vacuum 0.6 bar (abs)
Dimensions: 755mm x 730mm x 500mm
Weight: 33kg
Voltage: 110V / 220V

Features and Options:

True Vertical Technology™ with 95mm Z-movement
Time/Pressure dispenser, stamping or preform spindle
Pick & place spindle with force sensor and 360° tool rotation, optional tool heating and scrub
XY air-cushioned placement stage with fine adjustment control
Touchscreen interface for mode selection and custom sequence creation
Flip-Chip Ultra module with beam splitter optics for simultaneous viewing of two objects

Conclusion: The T-4909-AE is an ideal solution for those seeking a reliable and ergonomically designed die bonder for various bonding applications, offering high precision and flexibility with its advanced features and options.

Catalog excerpts

For the past 40 years, Dr. Tresky AG has been perfecting the art of creating die bonding / pick & place systems. The T-4909-AE anniversary edition is a manual, budget sensitive die bonder with superior ergonomic design. As with all of Tresky’s products, the T-4909-AE incorporates True Vertical Technology™ which guarantees parallelism between chip and substrate at any bond height. Bonding parameters and sequences, intuitively programmable by an integrated Raspberry PC with touchscreen. - Epoxy - Eutectic - Flip-Chip Force controlled True Vertical Technology™ Easy to use micro assembly Dr. TRESKY AG Switzerland [email protected] www.tresky.

Open the catalog to page 1

Excellent performance, ergonomically designed and high reliability makes the T-4909-aE ideal for small and medium volume production. applications TRUE VERTICAL TECHNOLOGY™ with 95mm Z-movement Time/Pressure dispenser, stamping or preform spindle The software displays the overlayed beam splitter image and is very easy to use. XY air-cushioned placement stage with fine adjustement control, supporting: Waffle- / Gel-Pak -, Substrate - Holder, various Heating Plates. Technical Data XY- Movement (placement stage): Z- Movement: Spindle Rotation: Bond Force: Placement accuracy: Flip-Chip Placement accuracy:...

Open the catalog to page 2

All Dr. Tresky AG catalogs and technical brochures

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Archived catalogs

Manual Die Bonder
1 Page