For the past 40 years, Dr. Tresky AG has been perfecting the art of creating die bonding / pick & place systems. The T-4909-AE anniversary edition is a manual, budget sensitive die bonder with superior ergonomic design. As with all of Tresky’s products, the T-4909-AE incorporates True Vertical Technology™ which guarantees parallelism between chip and substrate at any bond height. Bonding parameters and sequences, intuitively programmable by an integrated Raspberry PC with touchscreen. - Epoxy - Eutectic - Flip-Chip Force controlled True Vertical Technology™ Easy to use micro assembly Dr. TRESKY AG Switzerland [email protected] www.tresky.

Excellent performance, ergonomically designed and high reliability makes the T-4909-aE ideal for small and medium volume production. applications TRUE VERTICAL TECHNOLOGY™ with 95mm Z-movement Time/Pressure dispenser, stamping or preform spindle The software displays the overlayed beam splitter image and is very easy to use. XY air-cushioned placement stage with fine adjustement control, supporting: Waffle- / Gel-Pak -, Substrate - Holder, various Heating Plates. Technical Data XY- Movement (placement stage): Z- Movement: Spindle Rotation: Bond Force: Placement accuracy: Flip-Chip Placement accuracy:...