T-3002-PRO NEW The T-3002-PRO series is Tresky’s most flexible die bonding platform. The systems can run all basic functions as well as the industries most advanced applications by adding a wide range of available options. As with all of Tresky’s products, the PRO incorporates True Vertical Technology™ which guarantees parallelism between chip and substrate at any bond height. Together with superior ergonomics the PRO platform is the industry’s most sophisticated system in its class and with the new PC software even easier to operate. The T-3002-PRO is equiped with Tresky's die ejector system for pick-up from wafer. micro assembly True Vertical Technology™ Ultra precise bond-height control Unique pick-up from wafer Full PC-Control Dr. TRESKY AG Switzerland [email protected] www.tre

Advanced multi functional Die Bonder with superior ergonomic design and programmable, high accuracy ZDrive and bonding force control. applications - Z-Drive with Bonding Force Control - TRUE VERTICAL TECHNOLOGY™ Z-movement 95mm with 360° Tool rotation; Dispenser, Stamping, Ultrasonic, Scrub,Tool Heating, Pre Form, ... Interface for all bonding parameter, temperature profile and video imaging of Beam Splitter Optics, Process Inspect. Camera XY placement stage supporting: Waffle/Gel - Pack -, Substrate Holder, various Heating Plates - Flip-Chip Ultra Beam Splitter with multi point alignment » 1μm...