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Semiconductor Tools & Material Technology
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Semiconductor Tools & Material Technology - 1

SEMICONDUCTOR Tools & Material Technology

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Semiconductor Tools & Material Technology - 2

SEMICONDUCTOR PROCESS We have 39 international branch offices strategically located around the world to give customers the fastest and most accessible products and services. Our manufacturing plants, located in Singapore, Malaysia (Seremban), China (Suzhou) and France are governed by consistent quality systems with ISO 9001:2008 and ISO 14001:2004 certifications. Eurostat, France Stream of Products & Services • Electrostatic Discharge Control • Micro Contamination Control • Dry Packaging / Electronic Packaging Materials • Electronic Equipment and Tools • Bio Medical • Chemical for...

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Semiconductor Tools & Material Technology - 3

WAFER FRAME CASSETTES WAFER FRAME Our Wafer Frames are manufactured using the latest state-of-the-art technology. Strict in-process control is maintained throughout the manufacturing stages and there is minimal handling, further ensuring consistency in the quality of our wafer frames. 5” Wafer Frame 6” Wafer Frame 8” Wafer Frame 12”Wafer Frame Customize Wafer Frames for 6” wafer frame (DY-WFR-003) Industrial Standards Wafer Size (inch) Frame Square Blocking (mm) Global Capabilit y, Local Focus

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Semiconductor Tools & Material Technology - 4

SEMICONDUCTOR WAFER-DIE SEPARATION SOLUTIONS NIKALET ECR is a melamine based mold cleaner developed by Nippon Carbide Industries Co., Inc. specially designed for epoxy molding user. UDM Systems® , LLC products are specifically designed for use in multiple applications in semiconductor manufacturing industries. Both our consumable products and dispensing equipment are specially designed to be environmental friendly, as well as a robust and easy to use technology. We strive to provide the best suited product to our customers as well as hands-on support for process development and...

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Semiconductor Tools & Material Technology - 5

NIKALET ECR-C (Compression Type) Nikalet ECR has the three cleaning effects shown here. NIKALET ECR-C is Compression type melamine based mold cleaner. Customer can clean without using lead flame substrate and clean parting areas including air-vent by using ECR-C. ADHESION EFFECT Appearance Specific Density of Tablet Specific Gravity of Molded Cleaner Flow Hardness after Curing Application white ivory 1.0g-1.3g/cm3 1.4-1.6 80-100mm a) >70 b) Runner Gate, Cavity, Air-vent, Parting-area Cleaner adheres to the stain and peels it off from the surface of mold. GRINDING EFFECT a) Analyzed by JIS...

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Semiconductor Tools & Material Technology - 6

MOLDING LINER NIKALET RCC (Rubber Type Cleaner) The cleaning sheet NIKALET RCC is a mold rubber type cleaner for the removal of mold stains which happen during the molding epoxy molding for encapsulation of semiconductors such as integrated circuits, diodes, transistors, etc. Characteristics of Molding Liner Appearance Specific Gravity Molding Method Viscosity 1) Contribute to: Cost reduction Time saving Cleaning effect Process simplification Easy disposal Standardization Unskilled -one sheets will be equivalent with 2 dummy faces -reduce time for cleaning process -cleaning cavity,...

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Semiconductor Tools & Material Technology - 7

Precision manufacturing involves preparing surfaces for bonding, coating or exposure to a special processing and environment that are highly sensitive to residues. Key concerns in selecting detergent for precision manufacturing are efficiency in cleaning and non-use of volatile solvents, strong acids and other hazardous chemicals. DY 35 Concentrated Surfactant (for cleaning mold cavity bars) DY 35 is a concentrated cleaning agent which is foaming, alkaline and odorless. It is made up of anionic and nonionic surfacing agents, phosphates and polyphosphates, hydrates and chlorinated agents....

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Dou Yee can supply molecular sieve, clay or silica gel in various packing material depending on your application and requirements. Our desiccants can be used widely for protecting your goods against harmful effect of moisture and for preventing corrosion. Areas of application includes fry packing for ICs, medical instruments, machine parts, electronic components, optical equipment, tools documents, cameras. Bentonite Clay Product Code PACKING MTRL OPTION: TY1/NW1 REACH Regulation DESCRIPTION CHARACTERISTICS Indicating Spots Shipping Weight Blotting Paper Heavy Black On White Global...

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Netherlands France Poland Slovakia Hungary Taiwan Hong Kong Vietnam Philippines Malaysia Headquarter Singapore Sales Office Warehouse Warehouse & Manufacturing HEAD OFFICE Singapore 2304 Bedok Reservoir Road Bedok Industrial Park C Singapore 479223 Tel: (65) 6444 2678 | Fax: (65) 6743 7172 | Email: s1_marketing@douyee.com.sg Oversea offices MALAYSIA Johor Bahru No. 131 & 131A, Jalan Seri Impian 1, Taman Impian Emas, 81300 Johor Bahru, Malaysia. Tel: (607) 556 6284 / 558 6285 Fax: (607) 556 6273 Email: jhbsales1@douyee.com.my CHINA Shanghai 3rd Floor, Block C, Hi-Tech Industrial Center, No....

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All DOU YEE catalogs and technical brochures

  1. Nikalet RCC

    4 Pages

  2. Nikalet ECR

    6 Pages

  3. Prostat

    17 Pages