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- Dongguan Kizi Precision Lapping Mechanical Manufacture Co., Ltd
- Double Side Lapping Machine KS25B
Double Side Lapping Machine KS25B
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Double Side Lapping Machine KS25B
Product catalog summary
Machine Principle:
The document outlines the principle of a double-sided flat lapping and polishing machine, which is designed for precision grinding and polishing of various hard and brittle materials.
The document outlines the principle of a double-sided flat lapping and polishing machine, which is designed for precision grinding and polishing of various hard and brittle materials.
Applications:
This machine is primarily used for double-sided grinding and polishing of materials such as optical glass, crystal, quartz wafer, sapphire glass, lithium niobate, gallium arsenide, ceramics, sheet ferrite, silicon wafer, valve plate, valve piece, friction plate, rigid sealing ring, cylinder piston ring, and oil pump blade. It is suitable for both metal and non-metal materials.
This machine is primarily used for double-sided grinding and polishing of materials such as optical glass, crystal, quartz wafer, sapphire glass, lithium niobate, gallium arsenide, ceramics, sheet ferrite, silicon wafer, valve plate, valve piece, friction plate, rigid sealing ring, cylinder piston ring, and oil pump blade. It is suitable for both metal and non-metal materials.
Technical Parameters:
The model KS25B (9B) has specific dimensions and capabilities, including:
The model KS25B (9B) has specific dimensions and capabilities, including:
- Dimensions: Φ642*408*45
- Processing capacity: 5
- Additional dimension: Φ202
- Speed range: 0-47
- Pressure range: 0.5-0.6
- Weight: 6.0
- Overall machine dimensions: 1680*1160*2330mm
- Weight: 1750
Principle and Case of Machine Processing:
The document mentions the model KS25B(9B) but does not provide further details in the provided text.
The document mentions the model KS25B(9B) but does not provide further details in the provided text.
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Catalog excerpts
DOUBLE SIDED FLAT LAPPING & POLISHING MACHINE APPLICATIONS It is mainly used for double-sided grinding and polishing of optical glass, crystal, quartz wafer, sapphire glass, lithium niobate, gallium arsenide, ceramics, sheet ferrite, silicon wafer, valve plate, valve piece, friction plate, rigid sealing ring, cylinder piston ring, oil pump blade and other metal and non-metal hard and brittle materials.
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Technical Parameters: Model
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Principle and Case of Machine Processing
Open the catalog to page 3Archived catalogs
KS700Y9 Pages
Kizi Company Profile21 Pages
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