LOW COST PLASMA SYSTEM ZEPTO / ATTO

Product catalog summary

Overview: This document provides technical specifications and applications for low-cost low-pressure plasma systems, specifically the ZEPTO and ATTO models, manufactured by Diener electronic GmbH + Co. KG. These systems are used for surface manipulation through plasma treatment across various industries.

Applications: The plasma systems are applicable in diverse fields including analysis (SEM, TEM), archaeology, automotive, elastomer, medical technology, plastic, research and development, semiconductor, small scale manufacturing, sensor technology, textile treatment, and PDMS.

Technical Specifications:

ZEPTO: Weighs approximately 15 kg without pump. The plasma chamber has a diameter of 105 mm and a length of 300 mm, with a volume of approximately 2.6 litres. It features two gas channels via needle valve, a plasma power supply of 40 kHz / 100 W (optional 13.56 MHz / 50 W), and manual electric control. Connections include a 6 mm Swagelok gas connection, 4 mm in and 6 mm out pipe, and a power supply of 220 V - 240 V AC / 6 A, 50 - 60 Hz. The exhaust tube is 10 mm in diameter, and it uses a rotary vane pump with a capacity of 2.5 m3/h.
ATTO: Weighs approximately 20 kg without pump. The plasma chamber has a diameter of 211 mm and a length of 300 mm, with a volume of approximately 10.5 litres. It also features two gas channels via needle valve, a plasma power supply of 40 kHz / 200 W (optional 13.56 MHz / 50 W), and manual electric control. Connections are similar to the ZEPTO model.

Plasma Processes:

Surface Deposition: Plasmapolymerization is used for depositing hydrophobic or hydrophilic layers using monomers with suitable vapor pressure.
Surface Etching: Used before microstructuring silicon or etching PTFE, plasma etching is performed without aggressive chemicals.
Surface Cleaning: Organic remains are chemically transformed during the plasma process, allowing for fine cleaning of nearly all materials with oxygen plasma.
Surface Activation: Transforms non-polar surfaces into adhesive surfaces by increasing surface energy without damaging material properties.

Catalog excerpts

ZEPTO / ATTO Water drop on untreated metal Grid cut test on untreated PP LABS-Test, which tests for silicone contamination, of a silicone contai- ning sample Water drop on plasma treated metal Grid cut test on plasma treated PP LABS-Test after plasma cleaning ilysis (SEM,TEM) omotive industry stomer industry iical technology stic industry niconductor industry isor technology tile treatment Diener electronic GmbH + Co. KG Email : [email protected] ZEPTO / ATTO Low Pressure Plasma Systems Diener electronic GmbH + Co. KG

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ZEPTO / ATTO Plasma technology can be used on different materials such as glass, metal, plastics, textiles and ceramics. Technical Data • Surface Cleaning (e.g. before bonding, soldering or gluing) 275 mm Organic remains are chemically transformed during the plasma process. The surface is subjected to a fine cleaning. Nearly all materials can be cleaned with an oxygen plasma. 185 mm 42 5m • Surface Activation m m 0m 45 42 5m m m 0m 45 • Surface Deposition - plasmapolymerization (e.g. depositing of hydrophobic / hydrophilic layers) Monomers with a suitable vapor pressure are implemented and used...

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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.

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