World’s Smallest PCI Express Open Architecture Embedded I/O Standard Key Features ♦♦ Compact, low profile form-factor—0.6x the size of a credit card! ♦♦ Single low-cost connector integrates all host and external I/O signals ♦♦ Provides up to 100 I/O points per module ♦♦ Leverages industry-standard buses such as PCI Express, USB, and SMBus ♦♦ Host form-factor and processor agnostic ♦♦ Coexists with PC/104, SUMIT, Qseven, ETX, XTX, COM Express, etc. ♦♦ Multiple FeaturePak modules may be present within one system ♦♦ Rugged and reliable ♦♦ Open industry standard FeaturePak is an exciting new embedded system expansion standard, originated by Diamond Systems, that provides a compact, low-cost method of adding I/O to board-level embedded computers. FeaturePak modules can be used as snap-in customization modules for commercial, off-the-shelf single-board computers (SBCs) and computer-on-module (COM) baseboards, or as functional blocks on fully-custom embedded electronics. This new mezzanine-style embedded I/O expansion standard is highly synergistic with existing and emerging bus-, I/O-, chip- and board-level technologies. It leverages the latest high-speed serial expansion standards—such as PCI Express and USB —and is compatible with a wide range of current and future processors, including both x86 and RISC architectures. time-to-market board-level development costs and risks ♦♦ Simplifies system design ♦♦ Eliminates cables, resulting in higher reliability, lower cost, and faster assembly ♦♦ Enables scalable and reconfigurable system design ♦♦ Enables easy product upgrades ♦♦ Protects from component obsolescence ♦♦ Encapsulates intellectual property ♦♦ Suitable for SBCs, baseboards, and proprietary all-in-one hardware designs ♦♦ Ideal for rapid-prototyping through high-volume applications ♦♦ Ideal format for silicon vendor reference designs ♦♦ Open standard increases market acceptance ♦♦ Reduces FeaturePak on COM Express baseboard FeaturePak modules Enable Faster and More Flexible Baseboard Design With their compact size and standardized connector, FeaturePak modules are easy-to-use macrocomponents that target a wide range of embedded applications. Embedded computer design can be greatly simplified by treating complex I/O subsystems as components, just as various types of COMs (computer-on-modules) Diamond Systems Corporation | www.diamondsystems.com allow designers to treat the core embedded computing functions as a plug-in building block. This macrocomponent approach greatly accelerate

FEATUREPAK-DAQ1616 FeaturePak Analog I/O Module with 2MHz A/D and Autocalibration ♦♦ 16 12-bit analog inputs with 2MHz maximum sampling rate ♦♦ Programmable input ranges, polarity, and mode ♦♦ 16K sample A/D FIFO with programmable threshold ♦♦ 16-bit analog outputs with 16 programmable range and polarity ♦♦ Autocalibration circuit with precision reference voltages ♦♦ programmable digital I/O 56 ♦♦ 32-bit counter/timers for A/D timing and general 2 purpose use ♦♦ 24-bit pulse-width modulator circuits 4 ♦♦ Watchdog timer with system reset capability ♦♦ PCI Express x1 lane host interface 1 ♦♦ FeaturePak...