System-On-Modules &Embedded SBCs Our Reliable and Scalable SOMs for Your Embedded Solutions, Our Innovative Embedded Boards for Intelligent Applications

We provide off-the-shelf System-On-Modules including COM Express Mini, COM Express Compact, COM Express Basic, Qseven, SMARC and Customized Design-in Services for various embedded computing solutions.

Carrier Board Form Factor

Our embedded boards (ranging from ultra-small Pico-ITX to full-function ATX j motherboards) provide service to a broad range of embedded applications based on cutting-edge platforms and technologies. Embedded SBCs & Industrial Motherboards Product Index _/\_ Embedded SBCs Form Factor Processor Platform Model Index

Embedded SBCs Form Factor Processor Platform Model Index

Customer-Oriented SOM Design-In Services Design Assistance ● Comprehensive evaluation of carrier board design during planning phase Hardware/Software Recommendations, Technical Specifications, Developing Schedule, and Database Schematic Review, Placement/Layout Review, Debugging Assistance Services, and General/Special Reference Design ● Comprehensive design documentation for designing carrier board Carrier Board Design Guide, User's Manual, Schematic & Layout Checklist, and 2D/3D Mechanical Drawing Strict Validation ● Strict validation and testing process ensures reliable deployments Dedicated...

Innovative Design & Services • Industrial-rated components with high MTBF over 100,000 hrs • Extended operating temperatures • High ESD protection for I/O ports • Signal integrity measurement • Wide range power design • 100% Japanese-made solid capacitor • Power hot plug protection for DC-in type SBC and Industrial Motherboards • Embedded BIOS and OS customization services • Windows licensing offerings • Android, Linux distribution (Yocto/Ubuntu/CentOS/Debian) (Hardware Monitor, SMBus, I2C, Brightness Control, GPIO,Watchdog) • Remote management utility • Express customization service: 30 days...

Easy System Integration • Optional peripheral: DC power module, Wi-Fi, Cellular, GPS module • Optimized low profile thermal solution: fanless for ULT and Atom based platform • Optional heatspreader for 4", 3.5", Pico-ITX SBC with efficient thermal dissipation • Unified mechanical design for rear I/O location, screw hole, and connector type • 1.8” small form factor fits space-limited applications • All-in-one 100% readiness standalone SBC • Ultra low power Fanless embedded SBC • Perfectly fits gateway application with a few I/O requirements • Thinner than general Mini-ITX, and only 25mm in height...

Supports high-performance multi-core processors, possesses high-performance edge computing capabilities, and offers flexible expandability, meeting the requirements of various industrial applications. It also supports multiple high-speed interfaces suitable for data-intensive and compute-intensive applications.

COM Express® Compact module is designed with computing capability and cost efficiency in a compact form factor with a footprint of 95 x 95 mm, making it the best Option for transportation and defense applications. DFI's Compact modules are available with COM Express® pin-out Type 2 and Type 6. Wide Temp

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COM Express® Mini module delivers high performance on a small footprint which features 55 x 84 mm in size. It is ideal for space-limited, power-saving and mobile applications. DFI's ultra-small modules are available with COM Express® pin-out Type 10. Wide Temp Wide Temp Wide Temp Model Name

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COM Express® Basic module provides high-level processing performance and high-speed interfaces for a wide range of computing-demand applications such as medical, transportation, and industrial automation. DFI's Basic modules are compatible with COM Express® pin-out Type 2, Type 6 and Type 7. Wide Temp Server Wide Temp Model Name

Wide Tempi RM590E/QM580E/HM570EI Wide Temp H CM246/QM370/HM3701 Wide Temp CM246/QM370/HM370 Wide Temp Model Name

Features yv SMARC ("Smart Mobility ARChitecture") is mainly designed for applications that require extremely energy-saving, constrained space, and high performance with a full-size module measuring 82 x 80 mm and short size measuring 82 x 50 mm. It's the ideal solution for digital signage, human-machine interface, automation, and portable devices. Model Name

Features y\. The Open Standard Module is a solderable system-on-module, optimized for rugged applications requiring vibration resistance and a compact form factor. Its modular design enhances cost efficiency, minimizes footprint, and allows for future interface expansion.The Open Standard Module is a solderable system-on-module, optimized for rugged applications requiring vibration resistance and a compact form factor. Its modular design enhances cost efficiency, minimizes footprint, and allows for future interface expansion. Qualcomm Model Name

yv Qseven is equipped with fast serial interfaces in an ultra-small form factor with a measurement of Just 70 x 70 mm. It is much smaller than other system-on-module standards such as COM Express, which makes it an ideal solution for space-limited and low power applications such as industrial automation, retail, and power & energy. Wide Temp Atom Wide Temp Atom Wide Temp Model Name

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Features y\ Our carrier board (also known as base board or evaluation board) offers a flexible engineering development environment for COM Express Type 10, Type 7, Type 6, Type 2, Qseven and SMARC to help our customers minimize installation requirements while reducing design time and cost. Coming Soon Model Name

SDMCompact & Smart Retail Signage Solutions-—11? oo xr® 1M 7049 S6092 06094 1 z 6606 Intel® Smart Display Module Is for next generation commercial AIO displays and visual loT devices. Intel® SDM provides the primary compute building block and requires an Interface board on the displays or host system to complete platform Implementation and provide standard end user physical Interfaces. Large Size: 175mm x 100mm Small Size: 60mm x 100mm