Embedded-System

Product catalog summary

Overview
This document provides a comprehensive overview of durable embedded systems designed for industrial-grade applications. It highlights various processor models, innovative designs, and the flexibility of these systems to meet diverse industrial needs.

Processor Model Index
The document lists a variety of processors including Intel® Core™, Intel® Atom®, AMD® Ryzen™, Qualcomm® Kryo™, and NXP i.MX processors. Each processor model is associated with specific embedded systems, indicating their suitability for different applications.

Innovative Design & Services
The embedded systems are designed with industrial-rated components, offering high MTBF, extended operating temperatures, and high ESD protection. They feature a wide range power design and Japan-made solid capacitors. The systems support express customization, strict revision control, and long product life cycle support.

Software Support
These systems offer embedded BIOS and OS customization services, support for Ubuntu IoT Hardware Certification, and multiple Android and Linux distributions. DFI provides embedded APIs for hardware monitoring and management.

Features of Embedded Systems
The systems are small, lightweight, yet powerful, equipped with the latest Intel® Core™ and AMD Ryzen™ processors. They offer optimized thermal solutions and ruggedized construction for durability across a wide temperature range. The systems are designed for flexibility with various form-factor configurations and mounting options.

AI Inference/Training System
The document discusses AI applications that integrate multiple AI models for complex data processing. The X6-MTH-ORN platform is highlighted for its flexibility in supporting multiple AI ecosystems, reducing hardware redundancy, and simplifying system integration.

System Specifications
Detailed specifications for various models such as X6-ORN, X6a-AGX, EC622-RPS, and EC180-CS are provided. These include processor details, memory capacity, storage options, expansion capabilities, I/O interfaces, and environmental operating conditions.

Conclusion
The document emphasizes the adaptability and robustness of these embedded systems, making them suitable for a wide range of industrial applications, from AI inference to automation and flaw analysis.

Specifications
The systems are categorized based on their platform (e.g., ULT, Atom, Server-Grade) and processor families (e.g., Intel Xeon, Intel Core, Intel Atom). Each model is detailed with its processor speed, TDP, cache size, and chipset information. Memory technology varies from DDR4 to DDR5, with capacities ranging from 8GB to 1024GB.

Storage and Expansion
Storage options include M.2 slots and SATA drives, with some models supporting hot-swap capabilities. Expansion slots are available in various configurations, including PCIe and M.2, to accommodate additional components like AI accelerator cards.

I/O Interfaces
The systems offer a range of I/O interfaces, including USB ports (USB 3.2, USB-C), Ethernet ports (GbE, 2.5GbE), and serial ports (RS-232/422/485). Display outputs include VGA, HDMI, and DP++.

Power and Cooling
Power inputs vary from 9V to 36V DC, with cooling solutions ranging from fanless designs to systems with optional fans. The systems are designed for various operating temperatures, suitable for industrial environments.

Construction and Mounting
The systems are constructed from materials like aluminum and metal, with mounting options including wall, VESA, and DIN rail mounts. Dimensions and weight vary across models.

OS Support
Supported operating systems include Windows 10 IoT, Windows Server editions, and various Linux distributions, ensuring compatibility with industrial applications.

Applications
These systems are ideal for industrial applications such as factory automation, IoT gateways, and smart healthcare, offering low power consumption and efficient thermal solutions.

Embedded Fanless PC
Models include ES220-CS and ES220F-CS, featuring 9th/8th Gen Intel® Core™ Processors, dual-channel DDR4 memory, and fanless cooling. They support Windows 10 IoT and Linux, with operating temperatures from -20°C to 70°C.

Ruggedized Embedded System
Models like ECX700-ASL and ECX700-ADP feature Intel® Atom® and 12th Gen Intel® Core™ Processors, with fanless cooling and support for Windows 10/11 IoT and Linux. They operate in temperatures from -40°C to 70°C.

Ultra Ruggedized System
Features include IP66 enclosure and smart vent design, ideal for outdoor IoT edge computing.

Contact Information
DFI Inc. has headquarters in Taiwan, with additional offices in the USA, Netherlands, China, and Japan.

Catalog excerpts

Embedded Systems Our Durable Embedded Systems for Your Industrial-grade Applications

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AI Inference / Training System Ultra Compact Fanless PC

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Rugged Design • Industrial-rated components with high MTBF over 100,000 hours • Extended operating temperatures • High ESD protection for I/O ports • Comprehensive signal integrity measurement • Wide range power design • 100% Japan-made solid capacitor • Power hot plug protection for DC-in type SBC and Industrial Motherboards Software Support • Embedded BIOS and OS customization services • Ubuntu IoT Hardware Certification • Multiple Android, Linux distribution support (Hardware monitor, SMBus, I2C, Brightness Control, GPIO, Watchdog) Embedded Total Solution • Express customization service: 30...

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Features on Our Embedded Systems _/s_ Small and Lightweight, but Powerful • Equipped with up to date Intel® Core™ and AMD Ryzen™ Processors with reliable memory design • Optimized low profile thermal solution to improve system durability and reliability • With ruggedized construction, the system survives a wide operating temperature range • Various types of compact designed system, smallest dimension up to 110 x 80mm x 60mm (W x H x D) • Innovative modular concept designed to meet OEM requirements • Replaceable I/O modules to provide I/O variations targeting industrial automation applications...

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AI Inference/ Training System GPU & High Performance CPU Actual AI applications are often composed of several AIs In real-world scenarios, AI applications are rarely singular in function. Instead, they are composed of multiple AI models working together to process complex data streams, perform predictive analytics, and enhance automation. From machine vision and natural language processing to industrial anomaly detection, integrating several AI models into a single system is essential for achieving comprehensive intelligence. The challenge lies in efficiently managing these AI models within an...

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DFI Product x MXM Powers the same performance as its discrete counterpart, the MXM module allows more flexibility in layout, from size, weight to heat dissipation, achieves a more compact system. Systems with MXM module also enjoys the possibility of future upgrades and has no worries about the overall solution layout. Supported MXM-compliant module: NVIDIA Driver Assistance Alder Lake N with M.2 Hailo PCI Express GPU Card Expandable

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AI Inference / Training System Model Name

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AI Inference / Training System Model Name

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Ultra Compact Fanless PC Low Power & Compact Solutions Features Our industrial compact embedded systems, powered by 12th/11th/7th/6th Gen IntelCore. ULV processors and/or low power Atom/ARM processors, deliver extremely low power consumption for efficient fanless thermal solution in an ultra-small size. The systems are also equipped with extensive I/O interfaces and have efficient wireless connectivity to the cloud. Fanless & Compact Embedded Systems are ideal for a wide range of industrial applications such as factory automation, IoT gateways, and smart healthcare. Excellent Thermal Dissipation...

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