• Digital radiography (DR) and computed tomography (CT) imaging of large objects.
• Inspection and quality control in automotive and aerospace industries.
• Inspection of containers and parts in heavy industries.

• Modular design scalable up to 4.1 m detector arrays with one controller.
• Seamless and precise imaging of large objects.
• High image quality with advanced photodiode and ASIC designs.
• Wide scanning speed range.

• Optimized for high-energy applications with X-ray energy range of 450 kVp–9 MeV.
• Active lengths per module: 410, 614, and 820 mm.
• Pixel pitches: 0.2 and 0.4 mm.
• 16-bit image data with built-in scatter shielding and collimator.
• Gigabit Ethernet interface for easy connection and remote firmware updates.
• Power on-time recording to track detector lifetime.
• Pixel discontinuity and bad pixel correction.
• Easy software design based on DT X-View2 software and development kit.

The X-Scan M01B series facilitates quick and accurate inspection of large-scale objects. The modular linear detector arrays are scalable to different inspection system lengths up to 4.1 meters with one controller and a single Gigabit Ethernet interface. The series supports high-energy applications with pixel pitches of 0.2 and 0.4 mm and module lengths of 410, 614, and 820 mm. The housing includes built-in X-ray scatter shielding and a collimator for applications from 450 kVp to 9 MeV.

The M01B series benefits from a next-generation digital platform and GigE interface, enabling a wide integration time range from 0.2ms to 128ms per line, expandable up to 32 s/line with built-in line summing and averaging. The robust protocol over GigE also allows remote firmware updates and various diagnostics functions. Superior low noise performance is achieved by digitizing the X-ray signal in the detector’s front-end electronics. Additionally, on-time recording of power, pixel discontinuity, and bad pixel correction ease maintenance and extend the lifetime of detector units.

• X-ray tube voltage range: 450 kVp-9 MeV.
• Active area length options per module: 410 mm / 614 mm / 820 mm.
• Pixel pitch: 0.2 mm and 0.4 mm.
• Scintillator material: Segmented CdWO₄ with a thickness of 10 mm.
• Maximum scanning speed: 200 cm/s.
• Integration time per line: 0.2 ms to 128 ms, expandable to 32 s with summing.
• A/D resolution: 16 bits with a dynamic range at lowest sensitivity > 16000:1.
• Sensitivity settings: 8 levels, Charge range 0.75 to 10.5 pC/Line.
• Data digital interface: 16 bits with Gigabit Ethernet and UDP protocol.
• Linearity: > 99%.
• Operational voltage: +10.8 V DC to +26 V DC.
• Power consumption: 40 W Max/module.
• Operational temperature: 0 - 40°C, humidity: 30 - 80%.
• Storage temperature: -10 to +50°C.
• On-board calibration, pixel discontinuity correction, and bad pixel correction.
• Pixel binning up to 4x (equivalent to 1.6mm pitch).
• Line averaging and summing up to 256x.
• Power on time recording up to 100,000 hours.
• EMC and RoHS compliance, IP classification: IP50.