INFINITY Z-FLEX ION BEAM SOLUTION TECHNICAL SPECIFICATION SHEET Denton Vacuum Infinity Z-Flex combines the best of ion beam etching and the best of ion beam sputtering in one tool to provide the flexibility for a wide range of applications. BENEFITS INCLUDE: • Ion beam etch and deposition in one vacuum chamber • Wide range of process pressures • Control of adatom energies • Atomically engineered thin film interfaces and surfaces • Low plasma damage etching • Excellent uniformity and repeatability • Able to accommodate multiple substrate sizes up to 12" Infinity Biased Target Deposition System Excellent thickness uniformity Dense, defect free films Biased substrate Low plasma damage etch Biased target sputtering Independent control of ion currents and energies, interface engineering Compatible with front-end options Easily scalable to meet throughput demands Automation software Enhanced process control Short MTTR/Long MTBF High system uptime and ease of maintenance 1259 North Church Street, Bldg 3, Moorestown, NJ USA 08057 | 1-800-666-6004 [email protected] | www.dento

SYSTEM OVERVIEW Get the best of ion beam etching and ion beam sputtering in one tool with the flexible Infinity Z-Flex Ion Beam system. The system is fully computer controlled and features an integrated single wafer transfer system, boasting a versatile and optimized geometry for numerous sputtering and etching/milling modes. Denton’s patented biased target sputtering (BTS), ion beam sputtering and biased substrate etching technologies are available in this package for enhanced thin film engineering and process control. Ion beam etching (IBE) uses an energetic, broad beam collimated and highly...