Catalog excerpts
Infinity RM Ion Beam Deposition System TECHNICAL SPECIFICATION SHEET The Infinity RM Ion Beam Deposition System provides the best quality films for the most demanding and challenging applications. BENEFITS INCLUDE: • Pre-configured end-to-end ion beam deposition system with options for hardware and monitors • Independent control of ion energy and flux – provides control of film microstructure, stoichiometry and stress • Stable deposition rates enable excellent control of film thickness and uniformity • Second ion source for ion-assisted deposition and pre-clean • Easy-to-use software built on GE Cimplicity – access to source code provided • Able to accommodate multiple substrate sizes up to 8” Infinity RM Ion Beam Deposition System Bird’s-eye View Infinity RM Ion Beam Deposition System Schematic Typical Deposition Rates Compound Aluminum Oxide (1102) Deposition Rate (A/min) Sputter Yield (molecules/ions) Indium Antimonide Lithium Niobate (Y-cut) Molybdenum Carbide 1259 North Church Street, Bldg 3, Moorestown, NJ USA 08057 | 1-800-666-6004 info@dentonvacuum.com | www
Open the catalog to page 1Infinity RM Ion Beam Deposition System Specifications Criteria for Selecting an Ion Beam System: • Single wafer Process: • Inert or reactive gas • Substrate/film specifications Substrate Size: • 1-inch to 8-inch diameter • Process rates • Substrate rotation Water Cooling Angled Deposition Substrate Stage Tilt Fixture: Single and Multi-Rotation • • • • • Single rotation available in 6 and 8 - inch diameter Water-cooled Deposition uniformities < ± 2% Etch uniformities < ± 5% Tilt capability for enhanced uniformity optimization Single Rotation Fixture Multi-Rotation Fixture Ion Beam Deposition...
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