INFINITY LANS SOLUTION
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INFINITY LANS SOLUTION TECHNICAL SPECIFICATION SHEET The Infinity Laboratory Alloy & Nanolayer System (LANS) uses Denton’s patented bias target sputtering technology for research and development of emerging dielectric, metallic, magnetic, superconducting and semiconducting thin film development. It enables unparalleled control of layer thickness, interface, alloy composition and materials flexibility. BENEFITS INCLUDE: • Wide range of process pressures • Control of adatom energies • Excellent uniformity and repeatability • Low defect and low contamination • Atomically engineered thin film interfaces and surfaces • Able to accommodate multiple substrate sizes up to 8" Bias target sputtering Independent control of ion currents and energies, interface engineering Large mean free path Collimation Dense films Electronic shuttering Instantaneous start/stop, Repeatability Compatible with front-end options Easily scalable to meet throughput demands Automation software Enhanced process control 1259 North Church Street, Bldg 3, Moorestown, NJ USA 08057 | 1-800-666-6004 info@dentonvacuum.com | www.dento

SYSTEM OVERVIEW The Denton Vacuum Infinity LANS offers biased target sputtering (BTS), a hybrid technology designed to enable the best qualities of ion beam sputtering (IBS) and conventional sputtering. In BTS, a low energy ion source (typically of the end-Hall or closed-drift Hall type) is directed at a negatively biased sputtering target. The maximum energy (typically < 30 eV) of the ions is less than the sputter threshold of the vacuum system materials. No effort is made to capture all the ions on the target because ions that miss the target do not generate unwanted sputtering. In...