INFINITY BIASED TARGET SPUTTERING SYSTEM
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INFINITY BIASED TARGET SPUTTERING SYSTEM TECHNICAL SPECIFICATION SHEET Patented biased target sputtering technology provides higher performance than traditional ion beam sputtering. BENEFITS INCLUDE: • Wide range of process pressures • Control of adatom energies • Excellent uniformity and repeatability • Low defect and low contamination • Atomically engineered thin film interfaces and surfaces • Able to accommodate multiple substrate sizes up to 8" Infinity Biased Target Sputtering System Biased target sputtering Independent control of ion currents and energies, interface engineering Large mean free path Collimation Dense films Electronic shuttering Instantaneous start/stop Repeatability Compatible with front-end options Easily scalable to meet throughput demands Automation software Enhanced process control Short MTTR/Long MTBF High system uptime and ease of maintenance 1259 North Church Street, Bldg 3, Moorestown, NJ USA 08057 | 1-800-666-6004 info@dentonvacuum.com | www.dentonv

SYSTEM OVERVIEW Denton Vacuum’s Infinity Biased Target Sputtering System is uniquely suited to demanding applications requiring atomically engineered thin films and interfaces. It offers a large range of process pressures, control of adatom energies and excellent uniformity and repeatability. High performance multilayer devices such as giant magnetoresistive multilayers, optical interference filters and gate dielectric stacks are particularly well suited to BTS. In BTS, a low energy ion source (typically of the end-Hall or closed-drift Hall type) is directed at a negatively biased...