Smart Card
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Adhesive Excellence and Process Intelligence Smart card Smart Card

The worldwide leader in products for the smart card industry ■ Innovative solutions and products for new DELO supplies a comprehensive product range adapted to all applications and requirements in the smart card industry. Advanced technology and extremely high quality have made DELO the market leader in this segment. ■ Technology and innovation leader ■ More than 20 years of experience in the smart card industry ■ Mature, long-term proven product range for all applications ■ Determination of the most efficient bonding approach to your particular application ■ Custom development for specific...

DELO’s smart card products have been tested and proven reliable. Our customers have tested and passed the most difficult tests in the industry: ■ TMCL temperature cycling ■ Thermal storage ■ THB temperature and humidity storage Verified quality ■ Bending test ■ Torsion test ■ Wrapping test on card or module basis ■ 3-wheel test ■ Linear pressure test on module basis ■ Punctual load test on module basis ■ HAST ■ Pressure cooker Satisfied customers IINIE S'A v - , ^ - i i S and many more

In the second step, the chip is placed, and the dh i is l distributed. The dh i adhesive i evenly di t ib t d Th adhesive quantity dispensed should be adjusted in such a way that the chip surface is completely wetted and the adhesive forms a circular but preferably small fillet. In the first step, the adhesive is dispensed with a shower head (multiple dispensing needle) or a single dispensing needle. Die attach Die attach for contact modules and dual-interface modules  Excellent adhesion to various substrates  Fast curing and long processing time for an efficient production process  Low...

Smart card module - flip-chip bonding FCOSTM, Infineon Technologies In the production of smart card modules, flip-chips DELO MONOPOX AC* adhesives are used on conventional are an economic alternative to the chip-on-board substrates, such as PC, PC / ABS, PEN or PET. technology. To bond flip-chips, DELO MONOPOX NU* or ■ Fast heat curing; curing possible in 6 s ■ Curing temperatures can be set between +80 °C and +210 °C, depending on process and substrate. Curing proceeds faster with increasing temperature. ■ High reliability in temperature shock test and at +85 °C / 85 % air humidity ■ High...

Dam & Fill UV-curing DELO KATIOBOND adhesives Dam & Fill smart card module. The circumferential, high-viscous dam encloses the low-viscous fill ■ Curing in seconds allows for short cycle times ■ UV-curing in the wavelength range of 320 - 380 nm (see page 10) ■ High ion purity ■ Minimal casting height allows for the thinnest possible laminations ■ Dam & Fill adhesives form a chemically homogeneous unit ■ Depending on the requirement profile, tensionequalizing and hard products are available ■ Excellent mechanical protection ■ High reliability, even beyond the typically required levels

Opaque, heat-curing DELO DAM&FILL adhesives Opaque in the VIS, UV and near IR range, in thin layers Increased copy protection by opaque encapsulation Short cycle times, curing in seconds Suitable for standard plans with heating bars Curing: only with heat by heating bars Good flow properties for flat encapsulation Mold-like mechanical protection Glob top smart card module Dam & Fill smart card module. The circumferential, high-viscous dam encloses the low-viscous fill

Adhesive for gap filling and bondingBetween card body and module Filling of the gap between card body and module with DELO KATIOBOND ■ Minimization of sink marks ■ Reinforcement of the thin rear wall of the cavity ■ Improvement of the printability in the chip area ■ Curing by preactivation with visible light in 0.5 to 1 s ■ Reliable curing until final strength at room temperature ■ Ideal compatibility with DELO’s Dam & Fill adhesives Increase strength of the module in the card body with DELO-DUOPOX ■ The removal of the module from the card is made ■ Reliable curing at room temperature...

Application: Display smart card The right DELO adhesive for any application Display cards are multi-purpose cards with special functions and a particularly high safety standard. They are equipped with a keyboard and a display, e. g., showing an on-time password when pressing the key. Application areas include web payment, home banking and external access to company networks. Gap filling and leveling with flexible, low-temperature-curing DELO MONOPOX adhesive or the room-temperature-curing DELO-DUOPOX adhesive Electrical connecting of flexible display with anisotropically conductive DELO...

LED curing lamp for chip encapsulantsDELOLUX 820 / 365: Innovative LED lamp for consistently high module quality The DELOLUX 820 curing lamp allows fast and even curing of DELO KATIOBOND Dam & Fill and glob top adhesives. This new lamp provides maximum power ■ Modular array of 4 or 6 individually controlled lamp heads ► Maximum output in in-line processes ► Easy-to-exchange lamp head ■ Optimized light exit area ► Evenly distributed intensity and homogeneous curing over the entire irradiation line immediately after switched on and delivers consistent process parameters over a typical...

Chip encapsulation process at Mühlbauer and ruhlamat In the production of chip modules for smart cards, the contacted chip is first encircled by a high-viscous adhesive (dam), that is subsequently filled with a low-viscous chip encapsulant (fill). The adhesive can be applied with systems provided by Mühlbauer or ruhlamat.

DELO Industrial Adhesives Headquarters ► Germany • Windach / Munich . China • Shanghai Japan • Yokohama Malaysia • Kuala Lumpur Singapore South Korea • Seoul Taiwan • Taipei Thailand • Bangkok USA • Sudbury, MA www.DELO-adhesives.com The data and information provided are based on tests performed under laboratory conditions. Reliable information about the behavior of the product under practical conditions and its suitability for a specific purpose cannot be concluded from this. It is the customer's responsibility to test the suitability of a product for the intended purpose by considering...